SNVSBJ2A April   2022  – September 2023 TPS38

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1.     8
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Voltage (VDD)
        1. 8.3.1.1 Undervoltage Lockout (VPOR < VDD < UVLO)
        2. 8.3.1.2 Power-On Reset (VDD < VPOR )
      2. 8.3.2 SENSE
        1. 8.3.2.1 SENSE Hysteresis
      3. 8.3.3 Output Logic Configurations
        1. 8.3.3.1 Open-Drain
        2. 8.3.3.2 Push-Pull
        3. 8.3.3.3 Active-High (RESET)
        4. 8.3.3.4 Active-Low (RESET)
      4. 8.3.4 User-Programmable Reset Time Delay
        1. 8.3.4.1 Reset Time Delay Configuration
      5. 8.3.5 User-Programmable Sense Delay
        1. 8.3.5.1 Sense Time Delay Configuration
      6. 8.3.6 Manual RESET (CTR1 / MR) and (CTR2 / MR) Input
      7. 8.3.7 Adjustable Voltage Thresholds
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 High Voltage – Fast AC Signal Monitoring For Power Fault Detection
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power Dissipation and Device Operation
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Creepage Distance
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4.1 Layout Guidelines

  • Make sure that the connection to the VDD pin is low impedance. Good analog design practice is to place a greater than 0.1 µF ceramic capacitor as near as possible to the VDD pin.
  • To further improve the noise immunity on the SENSEx pins, placing a 1 nF to 10 nF capacitor between the SENSEx pins and GND can reduce the sensitivity to transient voltages on the monitored signal.
  • If a capacitor is used on CTS1, CTS2, CTR1, or CTR2, place these components as close as possible to the respective pins. If the capacitor adjustable pins are left unconnected, make sure to minimize the amount of parasitic capacitance on the pins to less than 5 pF.
  • For open-drain variants, place the pull-up resistors on RESET1 and RESET2 pins as close to the pins as possible.
  • When laying out metal traces, separate high voltage traces from low voltage traces as much as possible. If high and low voltage traces need to run close by, spacing between traces should be greater than 20 mils (0.5 mm).
  • Do not have high voltage metal pads or traces closer than 20 mils (0.5 mm) to the low voltage metal pads or traces.