SNVSBJ2A April   2022  – September 2023 TPS38

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1.     8
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Voltage (VDD)
        1. 8.3.1.1 Undervoltage Lockout (VPOR < VDD < UVLO)
        2. 8.3.1.2 Power-On Reset (VDD < VPOR )
      2. 8.3.2 SENSE
        1. 8.3.2.1 SENSE Hysteresis
      3. 8.3.3 Output Logic Configurations
        1. 8.3.3.1 Open-Drain
        2. 8.3.3.2 Push-Pull
        3. 8.3.3.3 Active-High (RESET)
        4. 8.3.3.4 Active-Low (RESET)
      4. 8.3.4 User-Programmable Reset Time Delay
        1. 8.3.4.1 Reset Time Delay Configuration
      5. 8.3.5 User-Programmable Sense Delay
        1. 8.3.5.1 Sense Time Delay Configuration
      6. 8.3.6 Manual RESET (CTR1 / MR) and (CTR2 / MR) Input
      7. 8.3.7 Adjustable Voltage Thresholds
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 High Voltage – Fast AC Signal Monitoring For Power Fault Detection
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power Dissipation and Device Operation
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Creepage Distance
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC (1) TPS38 UNIT
DSK DYY
10-PIN 14-PIN
RθJA Junction-to-ambient thermal resistance 87.4 131.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 76.3 61.6 °C/W
RθJB Junction-to-board thermal resistance 54.2 56.6 °C/W
ψJT Junction-to-top characterization parameter 4.8 3.4 °C/W
ψJB Junction-to-board characterization parameter 54.2 56.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 34.8 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.