SBVS085J January   2007  – June 2017

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Immunity to SENSE Pin Voltage Transients
      2. 8.3.2 SENSE Input
      3. 8.3.3 Manual Reset (MR) Input
      4. 8.3.4 Selecting the Reset Delay Time
    4. 8.4 Device Functional Modes
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

DBV Package
6-Pin SOT-23
Top View
TPS3808G01-Q1 TPS3808G12-Q1 TPS3808G125-Q1 TPS3808G15-Q1 TPS3808G18-Q1 TPS3808G30-Q1 TPS3808G33-Q1 TPS3808G50-Q1 pinout_01_bvs085.gif
DRV Package
6-Pin WSON With Thermal Pad
Top View
TPS3808G01-Q1 TPS3808G12-Q1 TPS3808G125-Q1 TPS3808G15-Q1 TPS3808G18-Q1 TPS3808G30-Q1 TPS3808G33-Q1 TPS3808G50-Q1 pinout_02_bvs085.gif

Pin Functions

PIN I/O DESCRIPTION
NAME SOT-23 WSON
CT 4 3 I Reset period programming pin. Connecting this pin to VDD through a 40-kΩ to 200-kΩ resistor or leaving it open results in fixed delay times (see Electrical Characteristics). Connecting this pin to a ground referenced capacitor ≥ 100 pF gives user-programmable delay time. See the Selecting the Reset Delay Time for more information.
GND 2 5 Ground
MR 3 4 I Manual reset. Driving this pin low asserts RESET. MR is internally tied to VDD by a 90-kΩ pullup resistor.
RESET 1 6 O Reset. This is an open-drain output that is driven to a low impedance state when RESET is asserted (either the SENSE input is lower than the threshold voltage (VIT) or the MR pin is set to a logic low). RESET remains low (asserted) for the reset period after both SENSE is above VIT and MR is set to a logic high. A pullup resistor from 10 kΩ to 1 MΩ must be used on this pin and allows the reset pin to attain voltages higher than VDD.
SENSE 5 2 I Voltage sense. This pin is connected to the voltage to be monitored. If the voltage at this terminal drops below the threshold voltage (VIT), RESET is asserted.
VDD 6 1 I Supply voltage. It is good analog design practice to place a 0.1-μF ceramic capacitor close to this pin.
Thermal Pad Pad Thermal pad; connect to ground plan to enhance thermal performance of the package.