SBVS193D June   2012  – July 2015 TPS3831 , TPS3839

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VDD Transient Rejection
      2. 8.3.2 Manual Reset (MR) Input (TPS3831 Only)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation (VDD > VDD(min))
      2. 8.4.2 Below VDD(min) (V(POR) < VDD < VDD(min)
      3. 8.4.3 Below Power-On Reset (VDD < V(POR)
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Capacitor
        2. 9.2.2.2 Bidirectional Reset Pins
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Evaluation Modules
        2. 12.1.1.2 Spice Models
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range, unless otherwise noted(1)
MIN MAX UNIT
Voltage VDD, RESET –0.3 7 V
MR –0.3 VDD + 0.3 V
Current RESET pin –10 10 mA
Temperature(2) Operating ambient, TA –40 85 °C
Storage, Tstg –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) As a result of the low dissipated power in this device, the junction temperature is assumed to be equal to the ambient temperature.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDD Input supply voltage 0.9 6.5 V
VMR Manual reset pin voltage 0 VDD V
VRESET RESET pin voltage 0 6.5 V
IRESET RESET pin current 0 8 mA

7.4 Thermal Information

THERMAL METRIC(1) TPS3839 TPS3831, TPS3839 UNIT
DBZ (SOT23-3) DQN (X2SON)
3 PINS 4 PINS
RθJA Junction-to-ambient thermal resistance 346.6 216.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 124.4 161.7 °C/W
RθJB Junction-to-board thermal resistance 78.9 162.1 °C/W
ψJT Junction-to-top characterization parameter 11.5 5.1 °C/W
ψJB Junction-to-board characterization parameter 77.3 161.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 123.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

At TA = –40°C to 85°C, 0.9 V < VDD < 6.5 V, and C1 = 0.1 µF, unless otherwise noted. Typical values are at 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VDD Input supply voltage 0.9 6.5 V
V(POR) Minimum VDD voltage for valid output IOL = 1 µA 0.6 V
IDD Supply current (into VDD pin) Output not connected 150 500 nA
VOL Low-level output voltage (RESET pin) VDD = 0.9 V to 1.2 V, IOL = 120 µA 0.4 V
VDD = 1.2 V to 2.8 V, IOL = 0.5 mA 0.4
VDD = 2.8 V to 6.5 V, IOL = 2 mA 0.4
VOH High-level output voltage (RESET pin) VDD = 0.9 V to 1.2 V, IOH = –50 µA VDD – 0.4 V
VDD = 1.2 V to 3.3 V, IOH = –0.5 mA VDD – 0.4
VDD = 3.3 V to 6.5 V, IOH = –2 mA VDD – 0.4
VIL Low-level input voltage (MR pin) 0.3VDD V
VIH High-level input voltage (MR pin) 0.7VDD V
RMR MR pin pullup resistance 10 20 30 kΩ
Negative-going input threshold accuracy TA = 25°C ±1%
VIT– Negative-going threshold voltage TPS383xA09 0.874 0.9 0.914 V
TPS383xG12 1.073 1.1 1.117
TPS383xE16 1.482 1.52 1.543
TPS383xG18 1.628 1.67 1.695
TPS3839G25 2.267 2.325 2.360
TPS383xL30 2.564 2.63 2.669
TPS383xK33 2.857 2.93 2.974
TPS383xG33 3.003 3.08 3.126
TPS383xK50 4.271 4.38 4.446
Vhys Hysteresis voltage TPS383xA09 54 mV
TPS383xG12 11
TPS383xE16 15
TPS383xG18 17
TPS383xL30 26
TPS3839G25 23
TPS383xK33 29
TPS383xG33 31
TPS383xK50 44

7.6 Timing Requirements

At TA = –40°C to 85°C, 0.9 V < VDD < 6.5 V, and C1 = 0.1 µF, unless otherwise noted. Typical values are at 25°C.
MIN TYP MAX UNIT
td RESET delay time (power-up delay) 120 200 350 ms
tPD_VDD Propagation delay, VDD falling (power-down delay) 20 µs
tPD_MR Propagation delay from MR low to RESET low 46 ns
TPS3831 TPS3839 tim_bvs193.gifFigure 1. MR and VDD Reset Timing

7.7 Typical Characteristics

At TA = 25°C and C1 = 0.1 µF, unless otherwise noted.
TPS3831 TPS3839 G001_SBVS193.png
Figure 2. Supply Current vs Temperature
TPS3831 TPS3839 G003_SBVS193.png
Figure 4. Threshold Voltage vs Temperature
TPS3831 TPS3839 G005_SBVS193.png
Figure 6. VOH vs IOH and Temperature for VDD = 3.3 V
TPS3831 TPS3839 G007_SBVS193.png
Figure 8. VOL vs IOL and Temperature for VDD = 1.8 V
TPS3831 TPS3839 G009_SBVS193.png
Figure 10. VOL vs IOL and Temperature for VDD = 4.0 V
TPS3831 TPS3839 G002_SBVS193.png
Figure 3. Reset Delay vs Temperature
TPS3831 TPS3839 G004_SBVS193.png
Figure 5. VOH vs IOH and Temperature for VDD = 1.8 V
TPS3831 TPS3839 G006_SBVS193.png
Figure 7. VOH vs IOH and Temperature for VDD = 4.0 V
TPS3831 TPS3839 G008_SBVS193.png
Figure 9. VOL vs IOL and Temperature for VDD = 3.3 V
TPS3831 TPS3839 G010_SBVS193.png
Figure 11. Maximum Pulse Duration vs Percent of
Threshold Overdrive