SBVS285 February   2017 TPS3852-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit
      2.      Undervoltage Threshold (VITN) Accuracy vs Temperature
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 RESET
      2. 7.3.2 Manual Reset (MR)
      3. 7.3.3 Undervoltage Fault Detection
      4. 7.3.4 Watchdog Mode
        1. 7.3.4.1 SET1
        2. 7.3.4.2 Window Watchdog Timer
        3. 7.3.4.3 Watchdog Input (WDI)
        4. 7.3.4.4 CWD
        5. 7.3.4.5 Watchdog Output (WDO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 VDD is Below VPOR (VDD < VPOR)
      2. 7.4.2 Above Power-On-Reset, But Less Than VDD(min) (VPOR ≤ VDD < VDD(min))
      3. 7.4.3 Normal Operation (VDD ≥ VDD(min))
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 CWD Functionality
        1. 8.1.1.1 Factory-Programmed Timing Options
        2. 8.1.1.2 Adjustable Capacitor Timing
      2. 8.1.2 Overdrive Voltage
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Monitoring the 3.3-V Rail
        2. 8.2.2.2 Calculating RESET and the WDO Pullup Resistor
        3. 8.2.2.3 Setting the Window Watchdog
        4. 8.2.2.4 Watchdog Disabled During Initialization Period
      3. 8.2.3 Glitch Immunity
      4. 8.2.4 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
      2. 11.1.2 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TPS3852-Q1UNIT
DRB (VSON)
8 PINS
RθJA Junction-to-ambient thermal resistance 47.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51.5 °C/W
RθJB Junction-to-board thermal resistance 22.2 °C/W
ψJT Junction-to-top characterization parameter 1.3 °C/W
ψJB Junction-to-board characterization parameter 22.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.