SNVSBT6C July 2021 – December 2022 TPS38700-Q1
PRODUCTION DATA
THERMAL METRIC(1) | TPS38700x-Q1 | UNIT | |
---|---|---|---|
RGE (VQFN) | |||
PINS | |||
RθJA | Junction-to-ambient thermal resistance | 53.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 51.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 17.2 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 20.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.9 | °C/W |