SNVSC27A October   2022  – November 2022 TPS38700

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device State Diagram
      2. 8.3.2 Built-In Self Test and Configuration Load
      3. 8.3.3 CLK32K
      4. 8.3.4 BACKUP State
      5. 8.3.5 FAILSAFE State
      6. 8.3.6 Transitioning Sequences
        1. 8.3.6.1 Sequence 1: Power Up
        2. 8.3.6.2 Sequence 2: Emergency Power Down
        3. 8.3.6.3 Sequence 3: Sleep Entry
        4. 8.3.6.4 Sequence 4: Sleep Exit
        5. 8.3.6.5 Sequence 5 & 6: Power Down from Active and Sleep States
        6. 8.3.6.6 Sequence 7: Sleep Exit Due to NRST_IN
        7. 8.3.6.7 Sequence 8: RESET Due to NRST_IN
        8. 8.3.6.8 Sequence 9: Failsafe Power Down
        9. 8.3.6.9 Output Sequencing
      7. 8.3.7 I2C
    4. 8.4 Register Map Table
      1. 8.4.1 Register Descriptions
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Automotive Multichannel Sequencer and Monitor
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power Supply Guidelines
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
      1.      Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.