SNVSC27A October   2022  – November 2022 TPS38700

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device State Diagram
      2. 8.3.2 Built-In Self Test and Configuration Load
      3. 8.3.3 CLK32K
      4. 8.3.4 BACKUP State
      5. 8.3.5 FAILSAFE State
      6. 8.3.6 Transitioning Sequences
        1. 8.3.6.1 Sequence 1: Power Up
        2. 8.3.6.2 Sequence 2: Emergency Power Down
        3. 8.3.6.3 Sequence 3: Sleep Entry
        4. 8.3.6.4 Sequence 4: Sleep Exit
        5. 8.3.6.5 Sequence 5 & 6: Power Down from Active and Sleep States
        6. 8.3.6.6 Sequence 7: Sleep Exit Due to NRST_IN
        7. 8.3.6.7 Sequence 8: RESET Due to NRST_IN
        8. 8.3.6.8 Sequence 9: Failsafe Power Down
        9. 8.3.6.9 Output Sequencing
      7. 8.3.7 I2C
    4. 8.4 Register Map Table
      1. 8.4.1 Register Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Automotive Multichannel Sequencer and Monitor
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power Supply Guidelines
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
      1.      Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.2 Built-In Self Test and Configuration Load

Built-In Self Test (BIST) is performed:

  • AT POR, if TEST_CFG_AT_POR = 1

  • When exiting Sequence 5 or Sequence 6, if TEST_CFG_AT_SHDN = 1 and the power down is not initiated by CTL_1. FORCE_SHDN[1:0] being set to 01b, 10b, or 11b.

Configuration load from OTP is assisted by ECC (supporting SEC-DED). This is to protect against data integrity issues and to maximize sysetem availability.

During BIST, NIRQ is de-asserted (asserted in case of failure), NRST is held low, ENx pins are held low (including pins with alternate functions), CLK32K is held low, input pins are ignored, and the I2C block is inactive with SDA and SCL de-asserted. Once BIST is completed without failure, I2C is immediately active and the device enters SHDN1 state after loading the configuration data from OTP. If BIST fails and/or ECC reports Double-Error Detection (DED), NIRQ is asserted, the device enters the FAILSAFE state (inputs are ignored), and a best effort attempt is made to active I2C. TEST_STAT register may provide additional information on the test results.