SBVS303B March   2017  – February 2018 TPS3890-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application Circuit
      2.      VITN Accuracy vs Temperature
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 User-Configurable RESET Delay Time
      2. 8.3.2 Manual Reset (MR) Input
      3. 8.3.3 RESET Output
      4. 8.3.4 SENSE Input
        1. 8.3.4.1 Immunity to SENSE Pin Voltage Transients
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation (VDD > VDD(min))
      2. 8.4.2 Above Power-On-Reset But Less Than VDD(min) (VPOR < VDD < VDD(min))
      3. 8.4.3 Below Power-On-Reset (VDD < VPOR)
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Timing Requirements

over the operating junction temperature range of –40°C to +125°C (TA = TJ), 1.5 V ≤ VDD ≤ 5.5 V, MR = VDD, and 5% input overdrive(1) (unless otherwise noted); typical values are at VDD = 5.5 V and TJ = 25°C
MINNOMMAXUNIT
tPD(f) SENSE (falling) to RESET propagation delay CT = open, VDD = 3.3 V 18 µs
CT = open, VDD = 5.5 V 8
tPD(r) SENSE (rising) to RESET propagation delay CT = open, VDD = 3.3 V 25 µs
tGI(SENSE) SENSE pin glitch immunity VDD = 5.5 V 9 µs
tGI(MR) MR pin glitch immunity VDD = 5.5 V 100 ns
tMRW MR pin pulse duration to assert RESET 1 µs
td(MR) MR pin low to out delay 250 ns
tSTRT Startup delay 325 µs
Overdrive = | (VIN / VTHRESH – 1) × 100% |.
TPS3890-Q1 td_tps3803_bvs050.gifFigure 1. Timing Diagram