SNVSBM4D March   2022  – October 2024 TPS389006-Q1 , TPS389R0-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  I2C
      2. 7.3.2  Auto Mask (AMSK)
      3. 7.3.3  Packet Error Checking (PEC)
      4. 7.3.4  VDD
      5. 7.3.5  MON
      6. 7.3.6  NIRQ
      7. 7.3.7  ADC
      8. 7.3.8  Time Stamp
      9. 7.3.9  NRST
      10. 7.3.10 Register Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Built-In Self Test and Configuration Load
        1. 7.4.1.1 Notes on BIST Execution
      2. 7.4.2 TPS389006/08-Q1,TPS389R0-Q1 Power ON
      3. 7.4.3 General Monitoring
        1. 7.4.3.1 IDLE Monitoring
        2. 7.4.3.2 ACTIVE Monitoring
        3. 7.4.3.3 Sequence Monitoring 1
          1. 7.4.3.3.1 ACT Transitions 0→1
          2. 7.4.3.3.2 SLEEP Transition 1→0
          3. 7.4.3.3.3 SLEEP Transition 0→1
        4. 7.4.3.4 Sequence Monitoring 2
          1. 7.4.3.4.1 ACT Transition 1→0
    5. 7.5 Register Maps
      1. 7.5.1 BANK0 Registers
      2. 7.5.2 BANK1 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Multichannel Sequencer and Monitor
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Guidelines
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Documentation Support
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.2 TPS389006/08-Q1,TPS389R0-Q1 Power ON

When the TPS389006/08-Q1,TPS389R0-Q1 is powered ON, BIST is optionally executed (depending on TEST_CFG.AT_POR register bit); I2C and fault reporting (through NIRQ) become active as soon as BIST is completed and configuration is loaded from OTP (assisted by ECC, supporting SEC-DED).

The details of the configuration load ECC and BIST results are reported in TEST_INFO register.

Upon detection of the ACT rising edge, the TPS389006/08-Q1,TPS389R0-Q1 starts the sequence timeout timer and the monitoring of the power ON sequence. SLEEP is ignored until ACT is High and the sequence timeout has expired. The TPS389006/08-Q1,TPS389R0-Q1 will then act on SLEEP transitions to monitor/record Sleep Entry/Exit sequences.

TPS389006-Q1 TPS389R0-Q1 TPS389006/08-Q1 Power ON Signaling and Internal StatesFigure 7-13 TPS389006/08-Q1 Power ON Signaling and Internal States

BIST completion can be detected through interrupt or register polling:

  • Interrupt: INT_TEST.I_BIST_C flag is set and NIRQ is asserted if IEN_TEST.BIST_C=1
  • Polling: VMON_STAT register can be polled to read the ST_BIST_C bit