SNVSC50 june   2023 TPS389006

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 I2C
      2. 8.3.2 Auto Mask (AMSK)
      3. 8.3.3 PEC
      4. 8.3.4 VDD
      5. 8.3.5 MON
      6. 8.3.6 NIRQ
      7. 8.3.7 ADC
      8. 8.3.8 Time Stamp
    4. 8.4 Device Functional Modes
      1. 8.4.1 Built-In Self Test and Configuration Load
        1. 8.4.1.1 Notes on BIST Execution
      2. 8.4.2 TPS389006 Power ON
      3. 8.4.3 General Monitoring
        1. 8.4.3.1 IDLE Monitoring
        2. 8.4.3.2 ACTIVE Monitoring
        3. 8.4.3.3 Sequence Monitoring 1
          1. 8.4.3.3.1 ACT Transitions 0→1
          2. 8.4.3.3.2 SLEEP Transition 1→0
          3. 8.4.3.3.3 SLEEP Transition 0→1
        4. 8.4.3.4 Sequence Monitoring 2
          1. 8.4.3.4.1 ACT Transition 1→0
    5. 8.5 Register Maps
      1. 8.5.1 BANK0 Registers
      2. 8.5.2 BANK1 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Multichannel Sequencer and Monitor
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
  11. 10Power Supply Recommendations
    1. 10.1 Power Supply Guidelines
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Documentation Support
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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