SLVSFM0C September   2020  – January 2024 TPS3899

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6.   Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 VDD Hysteresis
      2. 6.3.2 User-Programmable Sense and Reset Time Delay
      3. 6.3.3 RESET/RESET Output
      4. 6.3.4 SENSE Input
        1. 6.3.4.1 Immunity to SENSE Pin Voltage Transients
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation (VDD > VDD(min))
      2. 6.4.2 Above Power-On-Reset But Less Than VDD(min) (VPOR < VDD < VDD(min))
      3. 6.4.3 Below Power-On-Reset (VDD < VPOR)
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
      4. 7.2.4 Power Supply Recommendations
      5. 7.2.5 Layout
        1. 7.2.5.1 Layout Guidelines
        2. 7.2.5.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ± 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ± 750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.