SNVSCC2F November   2022  – July 2024 TPS389C03-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  I2C
      2. 7.3.2  Maskable Interrupt (AMSK)
      3. 7.3.3  VDD
      4. 7.3.4  MON
      5. 7.3.5  NRST
      6. 7.3.6  NIRQ
      7. 7.3.7  ADC
      8. 7.3.8  Packet Error Checking (PEC)
      9. 7.3.9  Q&A Watchdog
        1. 7.3.9.1 Question and Token Generation
        2. 7.3.9.2 Q&A Watchdog Open and Close Window Delay
        3. 7.3.9.3 Q&A Watchdog Status Register
        4. 7.3.9.4 Q&A Watchdog Timing
        5. 7.3.9.5 Q&A Watchdog State Machine and Test Program
      10. 7.3.10 Error Signal Monitoring (ESM)
        1. 7.3.10.1 ESM Timing
      11. 7.3.11 Register Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Built-In Self Test and Configuration Load
        1. 7.4.1.1 Notes on BIST Execution
      2. 7.4.2 TPS389C03-Q1 Power ON
  9. 8 Register Maps
    1. 8.1 Registers Overview
      1. 8.1.1 BANK0 Registers
      2. 8.1.2 BANK1 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Automotive Multichannel Sequencer and Monitor
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power Supply Guidelines
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Documentation Support
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Built-In Self Test and Configuration Load

Built-In Self Test (BIST) is performed at Power On Reset (POR), if TEST_CFG.AT_POR=1.

Configuration load from OTP is assisted by ECC (supporting SEC-DED). This is to protect against data integrity issues and to maximize system availability.

During BIST, NIRQ is de-asserted (asserted in case of failure), input pins are ignored, and the I2C block is inactive with SDA and SCL de-asserted. The BIST includes device testing to meet the Technical Safety Requirements. Once BIST is completed without failure, I2C is immediately active and the device enters the ACTIVE state after loading the configuration data from OTP. If BIST fails and/or ECC reports Double-Error Detection (DED), NIRQ is asserted low, NRST is asserted low, the device enters FAILSAFE state. The TEST_INFO register found in Section 8.1.1.11 provides information on the test coverage and results. Additionally, Watchdog and ESM are covered in Logic BIST as well and verified in BIST_L.

The detailed behavior upon success/failure of the BIST is controlled by INT_TEST and IEN_TEST registers. Reporting of the BIST results is carried out through:

  • NIRQ pin: pulled low depending on the test result and BIST_C and BIST bits in IEN_TEST
  • I_BIST_C and BIST bits in INT_TEST register depending on IEN_TEST settings
  • VMON_STAT.ST_BIST_C register bit
  • TEST_INFO[3:0] register bits