SNVSCC2F November   2022  – July 2024 TPS389C03-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  I2C
      2. 7.3.2  Maskable Interrupt (AMSK)
      3. 7.3.3  VDD
      4. 7.3.4  MON
      5. 7.3.5  NRST
      6. 7.3.6  NIRQ
      7. 7.3.7  ADC
      8. 7.3.8  Packet Error Checking (PEC)
      9. 7.3.9  Q&A Watchdog
        1. 7.3.9.1 Question and Token Generation
        2. 7.3.9.2 Q&A Watchdog Open and Close Window Delay
        3. 7.3.9.3 Q&A Watchdog Status Register
        4. 7.3.9.4 Q&A Watchdog Timing
        5. 7.3.9.5 Q&A Watchdog State Machine and Test Program
      10. 7.3.10 Error Signal Monitoring (ESM)
        1. 7.3.10.1 ESM Timing
      11. 7.3.11 Register Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Built-In Self Test and Configuration Load
        1. 7.4.1.1 Notes on BIST Execution
      2. 7.4.2 TPS389C03-Q1 Power ON
  9. Register Maps
    1. 8.1 Registers Overview
      1. 8.1.1 BANK0 Registers
      2. 8.1.2 BANK1 Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Automotive Multichannel Sequencer and Monitor
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power Supply Guidelines
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Documentation Support
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device Comparison

Figure 4-1 illustrates the device nomenclature. See Table 4-1 and Table 4-2 for more detailed information regarding the configuration of currently released variants. Table 10-1 provides a more in depth description of register configuration and data value stored.

Table 4-3 provides a summary of available device functions and corresponding part number. Contact TI sales representatives or go online to TI's E2E forum for details and availability of other options; minimum order quantities apply.

 

 

TPS389C03-Q1 TPS389C03-Q1
                        Device Nomenclature Figure 4-1 TPS389C03-Q1 Device Nomenclature
Table 4-1 TPS389C0x-Q1 Device Threshold Table
Ordering Code Monitor Channel Count Thresholds VMON2 (V) VMON3 (V) VMON4 (V)
TPS389C0300CRTERQ1 3 UV_HF/OV_HF 4.56/5.44 3.02/3.6 0.2/1.475
UV_LF/OV_LF 4.56/5.44 3.02/3.6 0.2/1.475
Table 4-2 TPS389C0x-Q1 Device Configuration Table
Ordering Code Functions Scaling OV/UV DEBOUNCE LF CUTOFF BIST PEC WD Open (ms) WD Close (ms) Max WD violation count I2c pull-up voltage (v)
TPS389C0300CRTERQ1 Monitor LF/HF 4/4/1 102.4 us 1kHz At POR Disabled 30 30 2 3.3V
Table 4-3 Multichannel Supervisor Summary Table
Specification TPS38900x-Q1 TPS389R0x-Q1(1) TPS38800x-Q1(1) TPS388R0x-Q1(1) TPS389C0x-Q1 TPS388C0x-Q1(1)
Hardware ASIL Rating D D B B D B
Monitoring Channel Count 4 to 8 4 to 7 4 to 8 4 to 7 3 to 6 3 to 6
Monitoring Range 0.2 to 5.5V 0.2 to 5.5V 0.2 to 5.5V 0.2 to 5.5V 0.2 to 5.5V 0.2 to 5.5V
Comparator Monitoring (HF Faults)

ADC Monitoring (LF Faults) x x x
Watchdog x x x x Q&A Window
Voltage Telemetry x x x
Monitor Glitch Filtering
Sequence Logging x x
NIRQ PIN
NRST PIN x x
SYNC PIN x x x x x
WDO PIN x x x x
WDI PIN x x x x x
ESM PIN x x x x x
Preview, contact TI sales representatives or on TI's E2E forum for details and availability of other options