SLUS964D NOVEMBER   2009  – March 2018 TPS40303 , TPS40304 , TPS40305

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Voltage Reference
      2. 7.3.2 Enable Functionality, Start-Up Sequence and Timing
      3. 7.3.3 Soft-Start Time
      4. 7.3.4 Oscillator and Frequency Spread Spectrum (FSS)
      5. 7.3.5 Overcurrent Protection
      6. 7.3.6 Drivers
      7. 7.3.7 Prebias Start-Up
      8. 7.3.8 Power Good
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
        1. 7.4.1.1 UVLO
        2. 7.4.1.2 Disable
        3. 7.4.1.3 Calibration
        4. 7.4.1.4 Converting
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Using the TPS40305 for a 12-V to 1.8-V Point-of-Load Synchronous Buck Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2  Selecting the Switching Frequency
          3. 8.2.1.2.3  Inductor Selection (L1)
          4. 8.2.1.2.4  Output Capacitor Selection (C12)
          5. 8.2.1.2.5  Peak Current Rating of Inductor
          6. 8.2.1.2.6  Input Capacitor Selection (C8)
          7. 8.2.1.2.7  MOSFET Switch Selection (Q1 and Q2)
          8. 8.2.1.2.8  Bootstrap Capacitor (C6)
          9. 8.2.1.2.9  VDD Bypass Capacitor (C7)
          10. 8.2.1.2.10 BP Bypass Capacitor (C5)
          11. 8.2.1.2.11 Short-Circuit Protection (R11)
          12. 8.2.1.2.12 Feedback Divider (R4, R5)
          13. 8.2.1.2.13 Compensation: (C2, C3, C4, R3, R6)
        3. 8.2.1.3 Application Curves
      2. 8.2.2 A High-Current, Low-Voltage Design Using the TPS40304
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1  Selecting the Switching Frequency
          2. 8.2.2.2.2  Inductor Selection (L1)
          3. 8.2.2.2.3  Output Capacitor Selection (C12)
          4. 8.2.2.2.4  Peak Current Rating of Inductor
          5. 8.2.2.2.5  Input Capacitor Selection (C8)
          6. 8.2.2.2.6  MOSFET Switch Selection (Q1 and Q2)
          7. 8.2.2.2.7  Bootstrap Capacitor (C6)
          8. 8.2.2.2.8  VDD Bypass Capacitor (C7)
          9. 8.2.2.2.9  BP Bypass Capacitor (C5)
          10. 8.2.2.2.10 Short-Circuit Protection (R11)
          11. 8.2.2.2.11 Feedback Divider (R4, R5)
          12. 8.2.2.2.12 Compensation: (C2, C3, C4, R3, R6)
        3. 8.2.2.3 Application Curves
      3. 8.2.3 A Synchronous Buck Application Using the TPS40303
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1  Selecting the Switching Frequency
          2. 8.2.3.2.2  Inductor Selection (L1)
          3. 8.2.3.2.3  Output Capacitor Selection (C12)
          4. 8.2.3.2.4  Peak Current Rating of Inductor
          5. 8.2.3.2.5  Input Capacitor Selection (C8)
          6. 8.2.3.2.6  MOSFET Switch Selection (Q1 and Q2)
          7. 8.2.3.2.7  Bootstrap Capacitor (C6)
          8. 8.2.3.2.8  VDD Bypass Capacitor (C7)
          9. 8.2.3.2.9  BP Bypass Capacitor (C5)
          10. 8.2.3.2.10 Short-Circuit Protection (R11)
          11. 8.2.3.2.11 Feedback Divider (R4, R5)
          12. 8.2.3.2.12 Compensation: (C2, C3, C4, R3, R6)
        3. 8.2.3.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Custom Design With WEBENCH® Tools
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 Related Links
    5. 11.5 Receiving Notification of Documentation Updates
    6. 11.6 Community Resources
    7. 11.7 Trademarks
    8. 11.8 Electrostatic Discharge Caution
    9. 11.9 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS4030x UNIT
DRC (VSON)
10 PINS
RθJA Junction-to-ambient thermal resistance 44.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.1 °C/W
RθJB Junction-to-board thermal resistance 19.2 °C/W
ψJT Junction-to-top characterization parameter 0.7 °C/W
ψJB Junction-to-board characterization parameter 19.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.