SLUSBO6C JANUARY   2014  – October 2018 TPS40425

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1. 3.1 Simplified Application Diagram (Dual Output)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Asynchronous Pulse Injection (API)
      2. 7.3.2  Adaptive Voltage Scaling (AVS)
      3. 7.3.3  Switching Frequency and Synchronization
      4. 7.3.4  Voltage Reference
      5. 7.3.5  Output Voltage and Remote Sensing Amplifier
      6. 7.3.6  Current Sensing and Temperature Sensing Modes
        1. 7.3.6.1 Non Smart-Power Operation
        2. 7.3.6.2 Smart-Power Operation.
      7. 7.3.7  Current Sensing
      8. 7.3.8  Temperature Sensing
      9. 7.3.9  Current Sharing
      10. 7.3.10 Linear Regulators
      11. 7.3.11 Power Sequence Between TPS40425 Device and Power Stage
      12. 7.3.12 PWM Signal
        1. 7.3.12.1 PWM Behavior During Soft-start Operation
      13. 7.3.13 Startup and Shutdown
      14. 7.3.14 Pre-Biased Output Start-up
      15. 7.3.15 PGOOD Indication
      16. 7.3.16 Overcurrent Protection
      17. 7.3.17 Overvoltage/Undervoltage Protection
      18. 7.3.18 Overtemperature Fault Protection
      19. 7.3.19 Input Undervoltage Lockout (UVLO)
      20. 7.3.20 Fault Communication
      21. 7.3.21 Fault Protection Summary
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Multi-Phase Applications
    6. 7.6 Register Maps
      1. 7.6.1 PMBus General Description
      2. 7.6.2 PMBus Functionality
        1. 7.6.2.1 PMBus Address
        2. 7.6.2.2 PMBus Connections
        3. 7.6.2.3 PMBus Data Format
        4. 7.6.2.4 PMBus Output Voltage Adjustment
          1. 7.6.2.4.1 No Margin Voltage
          2. 7.6.2.4.2 Margin High Voltage State
          3. 7.6.2.4.3 Margin Low State
      3. 7.6.3 Reading the Output Current
      4. 7.6.4 Soft-Start Time
      5. 7.6.5 Turn-On/Turn-Off Delay and Sequencing
    7. 7.7 Supported PMBus Commands
      1. 7.7.1  PAGE (00h)
      2. 7.7.2  OPERATION (01h)
      3. 7.7.3  ON_OFF_CONFIG (02h)
      4. 7.7.4  CLEAR_FAULTS (03h)
      5. 7.7.5  WRITE_PROTECT (10h)
      6. 7.7.6  STORE_USER_ALL (15h)
      7. 7.7.7  RESTORE_USER_ALL (16h)
      8. 7.7.8  CAPABILITY (19h)
      9. 7.7.9  VOUT_MODE (20h)
      10. 7.7.10 VIN_ON (35h)
      11. 7.7.11 VIN_OFF (36h)
      12. 7.7.12 IOUT_CAL_GAIN (38h)
      13. 7.7.13 IOUT_CAL_OFFSET (39h)
      14. 7.7.14 IOUT_OC_FAULT_LIMIT (46h)
      15. 7.7.15 IOUT_OC_FAULT_RESPONSE (47h)
      16. 7.7.16 IOUT_OC_WARN_LIMIT (4Ah)
      17. 7.7.17 OT_FAULT_LIMIT (4Fh)
      18. 7.7.18 OT_WARN_LIMIT (51h)
      19. 7.7.19 TON_RISE (61h)
      20. 7.7.20 STATUS_BYTE (78h)
      21. 7.7.21 STATUS_WORD (79h)
      22. 7.7.22 STATUS_VOUT (7Ah)
      23. 7.7.23 STATUS_IOUT (7Bh)
      24. 7.7.24 STATUS_TEMPERATURE (7Dh)
      25. 7.7.25 STATUS_CML (7Eh)
      26. 7.7.26 STATUS_MFR_SPECIFIC (80h)
      27. 7.7.27 READ_VOUT (8Bh)
      28. 7.7.28 READ_IOUT (8Ch)
      29. 7.7.29 READ_TEMPERATURE_2 (8Eh)
      30. 7.7.30 PMBus_REVISION (98h)
      31. 7.7.31 MFR_SPECIFIC_00 (D0h)
      32. 7.7.32 MFR_SPECIFIC_04 (VREF_TRIM) (D4h)
      33. 7.7.33 MFR_SPECIFIC_05 (STEP_VREF_MARGIN_HIGH) (D5h)
      34. 7.7.34 MFR_SPECIFIC_06 (STEP_VREF_MARGIN_LOW) (D6h)
      35. 7.7.35 MFR_SPECIFIC_07 (PCT_VOUT_FAULT_PG_LIMIT) (D7h)
      36. 7.7.36 MFR_SPECIFIC_08 (SEQUENCE_TON_TOFF_DELAY) (D8h)
      37. 7.7.37 MFR_SPECIFIC_16 (COMM_EEPROM_SPARE) (E0h)
      38. 7.7.38 MFR_SPECIFIC_21 (OPTIONS) (E5h)
      39. 7.7.39 MFR_SPECIFIC_22 (PWM_OSC_SELECT) (E6h)
      40. 7.7.40 MFR_SPECIFIC_23 (MASK SMBALERT) (E7h)
      41. 7.7.41 MFR_SPECIFIC_25 (AVS_CONFIG) (E9h)
      42. 7.7.42 MFR_SPECIFIC_26 (AVS_ADDRESS) (EAh)
      43. 7.7.43 MFR_SPECIFIC_27 (AVS_DAC_DEFAULT) (EBh)
      44. 7.7.44 MFR_SPECIFIC_28 (AVS_CLAMP_HI) (ECh)
      45. 7.7.45 MFR_SPECIFIC_29 (AVS_CLAMP_LO) (EDh)
      46. 7.7.46 MFR_SPECIFIC_30 (TEMP_OFFSET) (EEh)
      47. 7.7.47 MFR_SPECIFIC_32 (API_OPTIONS) (F0h)
      48. 7.7.48 MFR_SPECIFIC_44 (DEVICE_CODE) (FCh)
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Dual-Output Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Design Procedure
        1. 8.2.3.1  Switching Frequency Selection
        2. 8.2.3.2  Inductor Selection
        3. 8.2.3.3  Output Capacitor Selection
          1. 8.2.3.3.1 Output Voltage Deviation During Load Transient
          2. 8.2.3.3.2 Output Voltage Ripple
        4. 8.2.3.4  Input Capacitor Selection
        5. 8.2.3.5  VDD, BP5, BP3 Bypass Capacitor
        6. 8.2.3.6  R-C Snubber
        7. 8.2.3.7  Current and Temperature Sensor
        8. 8.2.3.8  Power Sequence Between the TPS40425 Device and Power Stage
        9. 8.2.3.9  Output Voltage Setting and Frequency Compensation Selection
        10. 8.2.3.10 Key PMBus Parameter Selection
          1. 8.2.3.10.1 MFR_SPECIFIC_21 (OPTIONS)
            1. 8.2.3.10.1.1 IOUT_CAL_GAIN
            2. 8.2.3.10.1.2 Enable and UVLO
            3. 8.2.3.10.1.3 Soft-Start Time
            4. 8.2.3.10.1.4 Overcurrent Threshold and Response
      4. 8.2.4 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layout Guidelines for TPS40425 Device
      2. 10.1.2 Layout Guidelines for Power Stage Device
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Texas Instruments Fusion Digital Power Designer
        2. 11.1.1.2 TPS40k Loop Compensation Tool
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.3.4 Input Capacitor Selection

The power stage input decoupling capacitance (effective capacitance at the VIN and PGND terminals) must be sufficient to supply the high switching currents demanded when the high-side MOSFET switches on, while providing minimal input voltage ripple as a result. This effective capacitance includes any DC bias effects. The voltage rating of the input capacitor must be greater than the maximum input voltage with derating. The capacitor must also have a ripple current rating greater than the maximum input current ripple to the device during full load. Use Equation 21 to estimate the input rms current.

Equation 21. TPS40425 q_de_iinrms_slusbv0.gif

The minimum input capacitance and ESR values for a given input voltage ripple specification, VIN(ripple), are shown in Equation 22 and Equation 23. The input ripple is composed of a capacitive portion, VRIPPLE(cap), and a resistive portion, VRIPPLE(esr).

Equation 22. TPS40425 q_de_cinmin_slusbv0.gif
Equation 23. TPS40425 q_de_esrcinmax_slusbv0.gif

The value of a ceramic capacitor varies significantly over temperature and the amount of DC bias applied to the capacitor. Minimize the capacitance variations due to temperature by selecting a dielectric material that is stable over temperature. X5R and X7R ceramic dielectrics are usually selected for power regulator capacitors because they have a high capacitance to volume ratio and are fairly stable over temperature.

The input capacitor must also be selected with the DC bias taken into account. This design requires a ceramic capacitor with at least a 25-V voltage rating to support the maximum input voltage. For this design, allow 0.1-V input ripple for VRIPPLE(cap), and 0.2-V input ripple for VRIPPLE(esr). Using Equation 22 and Equation 23, the minimum input capacitance for this design is 42.8 µF, and the maximum ESR is 7.3 mΩ. For this design example, five 22-μF, 25-V ceramic capacitors and two additional 100-μF, 25-V low-ESR electrolytic capacitors in parallel were selected for the power stage with sufficient margin.

A high frequency input voltage bypass capacitor is suggested to be placed close to the power stage to help with ringing reduction. Please refer to the datasheet of the power stage device for more application information of input capacitors.