SLVSA82F March   2011  – December 2014 TPS43330-Q1 , TPS43332-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Buck Controllers: Normal Mode PWM Operation
        1. 8.3.1.1 Frequency Selection and External Synchronization
        2. 8.3.1.2 Enable Inputs
        3. 8.3.1.3 Feedback Inputs
        4. 8.3.1.4 Soft-Start Inputs
        5. 8.3.1.5 Current Sensing and Current Limit With Foldback
        6. 8.3.1.6 Slope Compensation
        7. 8.3.1.7 Power-Good Outputs and Filter Delays
      2. 8.3.2 Boost Controller
      3. 8.3.3 Frequency-Hopping Spread Spectrum
      4. 8.3.4 Gate-Driver Supply (VREG, EXTSUP)
      5. 8.3.5 External P-Channel Drive (GC2) and Reverse-Battery Protection
      6. 8.3.6 Undervoltage Lockout and Overvoltage Protection
      7. 8.3.7 Thermal Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Buck Controllers: Current-Mode Operation
      2. 8.4.2 Buck Controllers: Light-Load PFM Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Boost Component Selection
        2. 9.2.2.2  Boost Maximum Input Current IIN_MAX
        3. 9.2.2.3  Boost Inductor Selection, L
        4. 9.2.2.4  Inductor Ripple Current, IRIPPLE
        5. 9.2.2.5  Peak Current in Low-Side FET, IPEAK
        6. 9.2.2.6  Right Half-Plane Zero RHP Frequency, fRHP
        7. 9.2.2.7  Output Capacitor, COUTx
        8. 9.2.2.8  Bandwidth of Boost Converter, fC
        9. 9.2.2.9  Output Ripple Voltage Due to Load Transients, ∆VOUTx
        10. 9.2.2.10 Selection of Components for Type II Compensation
        11. 9.2.2.11 Input Capacitor, CIN
        12. 9.2.2.12 Output Schottky Diode D1 Selection
        13. 9.2.2.13 Low-Side MOSFET (BOT_SW3)
        14. 9.2.2.14 BuckA Component Selection
          1. 9.2.2.14.1 BuckA Component Selection
          2. 9.2.2.14.2 Current-Sense Resistor RSENSE
        15. 9.2.2.15 Inductor Selection L
        16. 9.2.2.16 Inductor Ripple Current IRIPPLE
        17. 9.2.2.17 Output Capacitor COUTA
        18. 9.2.2.18 Bandwidth of Buck Converter fC
        19. 9.2.2.19 Selection of Components for Type II Compensation
        20. 9.2.2.20 Resistor Divider Selection for Setting VOUTA Voltage
        21. 9.2.2.21 BuckB Component Selection
        22. 9.2.2.22 Resistor Divider Selection for Setting VOUT Voltage
        23. 9.2.2.23 BuckX High-Side and Low-Side N-Channel MOSFETs
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Boost Converter
      2. 11.1.2 Buck Converter
      3. 11.1.3 Other Considerations
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation Derating Profile, 38-Pin HTTSOP PowerPAD™ Package
  12. 12Device and Documentation Support
    1. 12.1 Third-Party Products Disclaimer
    2. 12.2 Related Links
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 5. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS43330-Q1 Click here Click here Click here Click here Click here
TPS43332-Q1 Click here Click here Click here Click here Click here

12.3 Trademarks

PowerPAD is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.