SLVSA82F
March 2011 – December 2014
TPS43330-Q1
,
TPS43332-Q1
PRODUCTION DATA.
1
Features
2
Applications
3
Description
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Buck Controllers: Normal Mode PWM Operation
8.3.1.1
Frequency Selection and External Synchronization
8.3.1.2
Enable Inputs
8.3.1.3
Feedback Inputs
8.3.1.4
Soft-Start Inputs
8.3.1.5
Current Sensing and Current Limit With Foldback
8.3.1.6
Slope Compensation
8.3.1.7
Power-Good Outputs and Filter Delays
8.3.2
Boost Controller
8.3.3
Frequency-Hopping Spread Spectrum
8.3.4
Gate-Driver Supply (VREG, EXTSUP)
8.3.5
External P-Channel Drive (GC2) and Reverse-Battery Protection
8.3.6
Undervoltage Lockout and Overvoltage Protection
8.3.7
Thermal Protection
8.4
Device Functional Modes
8.4.1
Buck Controllers: Current-Mode Operation
8.4.2
Buck Controllers: Light-Load PFM Mode
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Boost Component Selection
9.2.2.2
Boost Maximum Input Current IIN_MAX
9.2.2.3
Boost Inductor Selection, L
9.2.2.4
Inductor Ripple Current, IRIPPLE
9.2.2.5
Peak Current in Low-Side FET, IPEAK
9.2.2.6
Right Half-Plane Zero RHP Frequency, fRHP
9.2.2.7
Output Capacitor, COUTx
9.2.2.8
Bandwidth of Boost Converter, fC
9.2.2.9
Output Ripple Voltage Due to Load Transients, ∆VOUTx
9.2.2.10
Selection of Components for Type II Compensation
9.2.2.11
Input Capacitor, CIN
9.2.2.12
Output Schottky Diode D1 Selection
9.2.2.13
Low-Side MOSFET (BOT_SW3)
9.2.2.14
BuckA Component Selection
9.2.2.14.1
BuckA Component Selection
9.2.2.14.2
Current-Sense Resistor RSENSE
9.2.2.15
Inductor Selection L
9.2.2.16
Inductor Ripple Current IRIPPLE
9.2.2.17
Output Capacitor COUTA
9.2.2.18
Bandwidth of Buck Converter fC
9.2.2.19
Selection of Components for Type II Compensation
9.2.2.20
Resistor Divider Selection for Setting VOUTA Voltage
9.2.2.21
BuckB Component Selection
9.2.2.22
Resistor Divider Selection for Setting VOUT Voltage
9.2.2.23
BuckX High-Side and Low-Side N-Channel MOSFETs
9.2.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.1.1
Boost Converter
11.1.2
Buck Converter
11.1.3
Other Considerations
11.2
Layout Example
11.3
Power Dissipation Derating Profile, 38-Pin HTTSOP PowerPAD™ Package
12
Device and Documentation Support
12.1
Third-Party Products Disclaimer
12.2
Related Links
12.3
Trademarks
12.4
Electrostatic Discharge Caution
12.5
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DAP|38
MPDS381
Thermal pad, mechanical data (Package|Pins)
DAP|38
PPTD158B
Orderable Information
slvsa82f_oa
slvsa82f_pm
5 Device Comparison Table
PART NUMBER
OPTION
TPS43330-Q1
Frequency-hopping spread spectrum OFF
TPS43332-Q1
Frequency-hopping spread spectrum ON