SLVSB48C August   2012  – July 2016 TPS43333-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Buck Controllers: Normal Mode PWM Operation
        1. 7.3.1.1 Frequency Selection and External Synchronization
        2. 7.3.1.2 Enable Inputs
        3. 7.3.1.3 Feedback Inputs
        4. 7.3.1.4 Soft-Start Inputs
        5. 7.3.1.5 Current-Mode Operation
        6. 7.3.1.6 Current Sensing and Current Limit With Foldback
        7. 7.3.1.7 Slope Compensation
        8. 7.3.1.8 Power-Good Outputs and Filter Delays
        9. 7.3.1.9 Light-Load PFM Mode
      2. 7.3.2 Boost Controller
      3. 7.3.3 SYNC Pin
      4. 7.3.4 Gate-Driver Supply (VREG, EXTSUP)
      5. 7.3.5 External P-Channel Drive (GC2) and Reverse-Battery Protection
      6. 7.3.6 Undervoltage Lockout and Overvoltage Protection
      7. 7.3.7 Thermal Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Application Example 1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Boost Component Selection
          2. 8.2.1.2.2  Boost Maximum Input Current IIN_MAX
          3. 8.2.1.2.3  Boost Inductor Selection, L
          4. 8.2.1.2.4  Inductor Ripple Current, IRIPPLE
          5. 8.2.1.2.5  Peak Current in Low-Side FET, IPEAK
          6. 8.2.1.2.6  Right Half-Plane Zero RHP Frequency, fRHP
          7. 8.2.1.2.7  Output Capacitor, CO
          8. 8.2.1.2.8  Bandwidth of Boost Converter, fC
          9. 8.2.1.2.9  Output Ripple Voltage Due to Load Transients, ∆VO
          10. 8.2.1.2.10 Selection of Components for Type II Compensation
          11. 8.2.1.2.11 Input Capacitor, CIN
          12. 8.2.1.2.12 Output Schottky Diode D1 Selection
          13. 8.2.1.2.13 Low-Side MOSFET (BOT_SW3)
          14. 8.2.1.2.14 BuckA Component Selection
            1. 8.2.1.2.14.1 Minimum On-Time, tON min
            2. 8.2.1.2.14.2 Current-Sense Resistor RSENSE
          15. 8.2.1.2.15 Inductor Selection L
          16. 8.2.1.2.16 Inductor Ripple Current IRIPPLE
          17. 8.2.1.2.17 Output Capacitor COUT
          18. 8.2.1.2.18 Bandwidth of Buck Converter fC
          19. 8.2.1.2.19 Selection of Components for Type II Compensation
          20. 8.2.1.2.20 Resistor Divider Selection for Setting VOUTA Voltage
          21. 8.2.1.2.21 BuckB Component Selection
          22. 8.2.1.2.22 Resistor Divider Selection for Setting VO Voltage
          23. 8.2.1.2.23 BuckX High-Side and Low-Side N-Channel MOSFETs
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Application Example 2
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Component Proposals
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Boost Converter
      2. 10.1.2 Buck Converter
      3. 10.1.3 Other Considerations
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation Derating Profile, 38-Pin HTTSOP PowerPAD Package
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

The TPS43333-Q1 is designed to operate from an input voltage up to 40 V. Ensure that the input supply is well regulated. Furthermore, if the supply voltage in the application is likely to reach negative voltage (for example, reverse battery) a forward diode must be placed at the input of the supply. For the VIN pin, a good quality X7R ceramic capacitor is recommended. Capacitance derating for aging, temperature, and DC bias must be taken into account while determining the capacitor value. Connect a local decoupling capacitor close to the VREG for proper filtering. The PowerPAD™ package, which offers an exposed thermal pad to enhance thermal performance, must be soldered to the copper landing on the PCB for optimal performance.