SLVSAV6E June   2011  – December 2015 TPS43335-Q1 , TPS43336-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Buck Controllers: Normal Mode PWM Operation
        1. 7.3.1.1 Frequency Selection and External Synchronization
        2. 7.3.1.2 Enable Inputs
        3. 7.3.1.3 Feedback Inputs
        4. 7.3.1.4 Soft-Start Inputs
        5. 7.3.1.5 Current-Mode Operation
        6. 7.3.1.6 Current Sensing and Current Limit With Foldback
        7. 7.3.1.7 Slope Compensation
        8. 7.3.1.8 Power-Good Outputs and Filter Delays
        9. 7.3.1.9 Light-Load PFM Mode
      2. 7.3.2 Boost Controller
      3. 7.3.3 Frequency-Hopping Spread Spectrum (TPS43336-Q1 Only)
      4. 7.3.4 Gate-Driver Supply (VREG, EXTSUP)
      5. 7.3.5 External P-Channel Drive (GC2) and Reverse Battery Protection
      6. 7.3.6 Undervoltage Lockout and Overvoltage Protection
      7. 7.3.7 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Buck Controllers: Current-Mode Operation
      2. 7.4.2 Buck Controllers: Light-Load PFM Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Automotive Infotainment Supply
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Boost Component Selection
          2. 8.2.1.2.2  Boost Maximum Input Current IIN_MAX
          3. 8.2.1.2.3  Boost Inductor Selection, L
          4. 8.2.1.2.4  Inductor Ripple Current, IRIPPLE
          5. 8.2.1.2.5  Peak Current in Low-Side FET, IPEAK
          6. 8.2.1.2.6  Right Half-Plane Zero RHP Frequency, fRHP
          7. 8.2.1.2.7  Output Capacitor, COUTx
          8. 8.2.1.2.8  Bandwidth of Boost Converter, fC
          9. 8.2.1.2.9  Output Ripple Voltage Due to Load Transients, ∆VOUTx
          10. 8.2.1.2.10 Selection of Components for Type II Compensation
          11. 8.2.1.2.11 Input Capacitor, CIN
          12. 8.2.1.2.12 Output Schottky Diode D1 Selection
          13. 8.2.1.2.13 Low-Side MOSFET (BOT_SW3)
          14. 8.2.1.2.14 BuckA Component Selection
            1. 8.2.1.2.14.1 BuckA Component Selection
            2. 8.2.1.2.14.2 Current-Sense Resistor RSENSE
          15. 8.2.1.2.15 Inductor Selection L
          16. 8.2.1.2.16 Inductor Ripple Current IRIPPLE
          17. 8.2.1.2.17 Output Capacitor COUTA
          18. 8.2.1.2.18 Bandwidth of Buck Converter fC
          19. 8.2.1.2.19 Selection of Components for Type II Compensation
          20. 8.2.1.2.20 Resistor Divider Selection for Setting VOUTA Voltage
          21. 8.2.1.2.21 BuckB Component Selection
          22. 8.2.1.2.22 Resistor Divider Selection for Setting VOUT Voltage
          23. 8.2.1.2.23 BuckX High-Side and Low-Side N-Channel MOSFETs
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Automotive ADAS Supply
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
  9. 9  Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Grounding and PCB Circuit Layout Considerations
        1. 10.1.1.1 Boost converter
        2. 10.1.1.2 Buck Converter
      2. 10.1.2 Other Considerations
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation Derating Profile, 38-Pin HTTSOP PowerPAD Package
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

TPS4333xEVM, SLVU457

11.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 7. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS43335-Q1 Click here Click here Click here Click here Click here
TPS43336-Q1 Click here Click here Click here Click here Click here

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.