SLVSAR7E June   2011  – October 2016 TPS43350-Q1 , TPS43351-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 Power Dissipation Derating Profile, 38-Pin HTTSOP PowerPAD Package
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Buck Controllers: Normal Mode PWM Operation
        1. 7.3.1.1 Frequency Selection and External Synchronization
        2. 7.3.1.2 Enable Inputs
        3. 7.3.1.3 Feedback Inputs
        4. 7.3.1.4 Soft-Start Inputs
        5. 7.3.1.5 Current-Mode Operation
        6. 7.3.1.6 Current Sensing and Current Limit With Foldback
        7. 7.3.1.7 Slope Compensation
        8. 7.3.1.8 Power-Good Outputs and Filter Delays
        9. 7.3.1.9 Light-Load PFM Mode
      2. 7.3.2 Frequency-Hopping Spread Spectrum (TPS43351-Q1 Only)
      3. 7.3.3 Gate-Driver Supply (VREG, EXTSUP)
      4. 7.3.4 External P-Channel Drive (GC2) and Reverse-Battery Protection
      5. 7.3.5 Undervoltage Lockout and Overvoltage Protection
      6. 7.3.6 Thermal Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  BuckA Component Selection
          1. 8.2.2.1.1 Minimum ON Time, tON min
          2. 8.2.2.1.2 Current-Sense Resistor RSENSE
        2. 8.2.2.2  Inductor Selection L
        3. 8.2.2.3  Inductor Ripple Current IRIPPLE
        4. 8.2.2.4  Output Capacitor COUTA
        5. 8.2.2.5  Bandwidth of Buck Converter fC
        6. 8.2.2.6  Selection of Components for Type II Compensation
        7. 8.2.2.7  Resistor Divider Selection for Setting VOUTA Voltage
        8. 8.2.2.8  BuckB Component Selection
        9. 8.2.2.9  Resistor Divider Selection for Setting VOUT Voltage
        10. 8.2.2.10 BUCKx High-Side and Low-Side N-Channel MOSFETs
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Buck Converter
      2. 10.1.2 Other Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 5. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS43350-Q1 Click here Click here Click here Click here Click here
TPS43351-Q1 Click here Click here Click here Click here Click here

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.