SLVSAR7E June   2011  – October 2016 TPS43350-Q1 , TPS43351-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 Power Dissipation Derating Profile, 38-Pin HTTSOP PowerPAD Package
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Buck Controllers: Normal Mode PWM Operation
        1. 7.3.1.1 Frequency Selection and External Synchronization
        2. 7.3.1.2 Enable Inputs
        3. 7.3.1.3 Feedback Inputs
        4. 7.3.1.4 Soft-Start Inputs
        5. 7.3.1.5 Current-Mode Operation
        6. 7.3.1.6 Current Sensing and Current Limit With Foldback
        7. 7.3.1.7 Slope Compensation
        8. 7.3.1.8 Power-Good Outputs and Filter Delays
        9. 7.3.1.9 Light-Load PFM Mode
      2. 7.3.2 Frequency-Hopping Spread Spectrum (TPS43351-Q1 Only)
      3. 7.3.3 Gate-Driver Supply (VREG, EXTSUP)
      4. 7.3.4 External P-Channel Drive (GC2) and Reverse-Battery Protection
      5. 7.3.5 Undervoltage Lockout and Overvoltage Protection
      6. 7.3.6 Thermal Protection
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  BuckA Component Selection
          1. 8.2.2.1.1 Minimum ON Time, tON min
          2. 8.2.2.1.2 Current-Sense Resistor RSENSE
        2. 8.2.2.2  Inductor Selection L
        3. 8.2.2.3  Inductor Ripple Current IRIPPLE
        4. 8.2.2.4  Output Capacitor COUTA
        5. 8.2.2.5  Bandwidth of Buck Converter fC
        6. 8.2.2.6  Selection of Components for Type II Compensation
        7. 8.2.2.7  Resistor Divider Selection for Setting VOUTA Voltage
        8. 8.2.2.8  BuckB Component Selection
        9. 8.2.2.9  Resistor Divider Selection for Setting VOUT Voltage
        10. 8.2.2.10 BUCKx High-Side and Low-Side N-Channel MOSFETs
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Buck Converter
      2. 10.1.2 Other Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.