SLVSAR7E June   2011  – October 2016 TPS43350-Q1 , TPS43351-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 Power Dissipation Derating Profile, 38-Pin HTTSOP PowerPAD Package
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Buck Controllers: Normal Mode PWM Operation
        1. 7.3.1.1 Frequency Selection and External Synchronization
        2. 7.3.1.2 Enable Inputs
        3. 7.3.1.3 Feedback Inputs
        4. 7.3.1.4 Soft-Start Inputs
        5. 7.3.1.5 Current-Mode Operation
        6. 7.3.1.6 Current Sensing and Current Limit With Foldback
        7. 7.3.1.7 Slope Compensation
        8. 7.3.1.8 Power-Good Outputs and Filter Delays
        9. 7.3.1.9 Light-Load PFM Mode
      2. 7.3.2 Frequency-Hopping Spread Spectrum (TPS43351-Q1 Only)
      3. 7.3.3 Gate-Driver Supply (VREG, EXTSUP)
      4. 7.3.4 External P-Channel Drive (GC2) and Reverse-Battery Protection
      5. 7.3.5 Undervoltage Lockout and Overvoltage Protection
      6. 7.3.6 Thermal Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  BuckA Component Selection
          1. 8.2.2.1.1 Minimum ON Time, tON min
          2. 8.2.2.1.2 Current-Sense Resistor RSENSE
        2. 8.2.2.2  Inductor Selection L
        3. 8.2.2.3  Inductor Ripple Current IRIPPLE
        4. 8.2.2.4  Output Capacitor COUTA
        5. 8.2.2.5  Bandwidth of Buck Converter fC
        6. 8.2.2.6  Selection of Components for Type II Compensation
        7. 8.2.2.7  Resistor Divider Selection for Setting VOUTA Voltage
        8. 8.2.2.8  BuckB Component Selection
        9. 8.2.2.9  Resistor Divider Selection for Setting VOUT Voltage
        10. 8.2.2.10 BUCKx High-Side and Low-Side N-Channel MOSFETs
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Buck Converter
      2. 10.1.2 Other Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage Input voltage: VBAT –0.3 60 V
Voltage
(Buck function:
BuckA and BuckB)		 Ground: PGNDA–AGND, PGNDB–AGND –0.3 0.3 V
Enable inputs: ENA, ENB –0.3 60 V
Bootstrap inputs: CBA, CBB –0.3 68 V
Bootstrap inputs: CBA–PHA, CBB–PHB –0.3 8.8 V
Phase inputs: PHA, PHB –0.7 60 V
Phase inputs: PHA, PHB (for 150 ns) –1 V
Feedback inputs: FBA, FBB –0.3 13 V
Error amplifier outputs: COMPA, COMPB –0.3 13 V
High-side MOSFET driver: GA1–PHA, GB1–PHB –0.3 8.8 V
Low-side MOSFET drivers: GA2–PGNDA, GB2–PGNDB –0.3 8.8 V
Current-sense voltage: SA1, SA2, SB1, SB2 –0.3 13 V
Soft start: SSA, SSB –0.3 13 V
Power-good output: PGA, PGB –0.3 13 V
Power-good delay: DLYAB –0.3 13 V
Switching-frequency timing resistor: RT –0.3 13 V
SYNC, EXTSUP –0.3 13 V
Voltage
(PMOS driver)		 P-channel MOSFET driver: GC2 –0.3 60 V
P-channel MOSFET driver: -GC2 –0.3 8.8 V
Voltage (Gate driver) Gate-driver supply: VREG –0.3 8.8 V
Temperature Junction temperature: TJ –40 150 °C
Operating temperature: TA –40 125 °C
Storage temperature: Tstg –55 165 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to AGND, unless otherwise stated.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM) AEC-Q100 Classification Level H2(1) ±2000 V
Charged-device model (CDM) AEC-Q100 Classification Level C2 Pins 12, 21, 22, and 27 ±400
Pins 1 and 20 ±750
All other pins ±500
Machine model (MM) Pins 15 and 24 ±150
All other pins ±200
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Buck function:
BuckA and BuckB voltage		 Input voltage: , VBAT 4 40 V
Enable inputs: ENA, ENB 0 40 V
Boot inputs: CBA, CBB 4 48 V
Phase inputs: PHA, PHB –0.6 40 V
Current-sense voltage: SA1, SA2, SB1, SB2 0 11 V
Power-good output: PGA, PGB 0 11 V
SYNC, EXTSUP 0 9 V
Temperature Operating temperature: TA –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS43333-Q1 UNIT
DAP (HTSSOP)
38 PINS
RθJA Junction-to-ambient thermal resistance 27.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 19.6 °C/W
RθJB Junction-to-board thermal resistance 15.9 °C/W
ψJT Junction-to-top characterization parameter 0.24 °C/W
ψJB Junction-to-board characterization parameter 6.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 DC Electrical Characteristics

VIN = 8 V to 18 V, TJ = –40°C to 150°C (unless otherwise noted)
NO. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
1.0 Input Supply
1.1 VBat Supply voltage After initial start-up, condition is satisfied. 4 40 V
1.2 VIN Input voltage required for device on initial start-up 6.5 40 V
Buck regulator operating range after initial start-up 4 40 V
1.3 VIN UV Buck undervoltage lockout VIN falling. After a reset, initial start-up conditions may apply.(1) 3.5 3.6 3.8 V
VIN rising. After a reset, initial start-up conditions may apply.(1) 3.8 4 V
1.5 Iq_LPM_ LPM quiescent current:
TA = 25°C(2)		 VIN = 13 V, BuckA: LPM, BuckB: off 30 40 µA
VIN = 13 V, BuckB: LPM, BuckA: off 30 40
VIN = 13 V, BuckA, B: LPM 35 45 µA
1.6 Iq_LPM LPM quiescent current:
TA = 125°C(2)		 VIN = 13 V, BuckA: LPM, BuckB: off 40 50 µA
VIN = 13 V, BuckB: LPM, BuckA: off 40 50
VIN = 13 V, BuckA, B: LPM 45 55 µA
1.7 Iq_NRM Quiescent current:
TA = 25°C(2)		 Normal operation, SYNC = High 4.85 5.3 mA
VIN = 13 V, BuckA: CCM, BuckB: off 7 7.6 mA
VIN = 13 V, BuckB: CCM, BuckA: off
VIN = 13 V, BuckA, B: CCM
1.8 Iq_NRM Quiescent current:
TA = 125°C(2)		 Normal operation, SYNC = High 5 5.5 mA
VIN = 13 V, BuckA: CCM, BuckB: off 7.5 8 mA
VIN = 13 V, BuckB: CCM, BuckA: off
VIN = 13 V, BuckA, B: CCM
1.9 IBAT_sh Shutdown current BuckA, B: off, VBAT = 13 V 3 5 µA
2.0 Input Voltage - Overvoltage Lockout
2.1 VOVLO Overvoltage shutdown VIN rising 45 46 47 V
VIN falling 43 44 45 V
2.2 OVLOHys Hysteresis 1 2 3 V
2.3 OVLOfilter Filter time 5 µs
Gate Driver for PMOS
3.1 rDS(on) PMOS OFF 10 20 Ω
3.2 IPMOS_ON Gate current VIN = 13.5 V, VGS = –5 V 10 mA
3.3 tdelay_ON Turnon delay C = 10 nF 5 10 µs
4.0 Buck Controllers
4.1 VBuckA/B Adjustable output voltage range 0.9 11 V
4.2 VREF, NRM Internal reference voltage and tolerance in normal mode Measure FBX pin 0.792 0.8 0.808 V
–1% 1%
4.3 VREF, LPM Internal reference voltage and tolerance in low-power mode Measure FBX pin 0.784 0.8 0.816 V
–2% 2%
4.4 VSENSE V sense for forward current limit in CCM FBx = 0.75 V (low duty cycles) 60 75 90 mV
4.5 V sense for reverse current limit in CCM FBx = 1 V –65 –37.5 –23 mV
4.6 VI-Foldback V sense for output short FBx = 0 V 17 32.5 48 mV
4.7 tdead Shoot-through delay, blanking time 100 ns
4.8 DCNRM High-side minimum on-time 100 ns
Maximum duty cycle (digitally controlled) 98.75%
4.9  DCLPM Duty cycle LPM 80%
4.10 ILPM_Entry LPM entry threshold load current as fraction of maximum set load current The exit threshold is specified to be always higher than entry threshold 1% . See(3)
ILPM_Exit LPM exit threshold load current as fraction of maximum set load current The exit threshold is specified to be always higher than entry threshold See(3) 10%
High-Side External NMOS Gate Drivers for Buck Controller
4.11 IGX1_peak Gate driver peak current 1.5 A
4.12 rDS(on) Source and sink driver VREG = 5.8 V, IGX1 current = 200 mA 2 Ω
Low-Side NMOS Gate Drivers for Buck Controller
4.13 IGX2_peak Gate-driver peak current 1.5 A
4.14 rDS(on) Source and sink driver VREG = 5.8 V, IGX2 current = 200 mA 2 Ω
Error Amplifier (OTA) for Buck Converters
4.15 GmBUCK Transconductance COMPA, COMPB = 0.8 V,
source/sink = 5 µA, test in feedback loop		 0.72 1 1.35 mS
4.16 IPULLUP_FBx Pullup current at FBx pins FBx = 0 V 50 100 200 nA
5.0 Digital Inputs: ENA, ENB, SYNC
5.1 VIH Higher threshold VIN = 13 V 1.7 V
5.2 VIL Lower threshold VIN = 13 V 0.7 V
5.3 RIH_SYNC Resistance VSYNC = 5 V 500 kΩ
5.5 IIL_ENx Pullup current source on ENA, ENB VENx = 0 V 0.5 2 µA
6.0 Switching Parameters – Buck DC-DC Controllers
6.1 fSW_Buck Buck switching frequency RT pin: GND 360 400 440 kHz
6.2 fSW_Buck Buck switching frequency RT pin: 60-kΩ external resistor 360 400 440 kHz
6.3 fSW_adj Buck adjustable range with external resistor RT pin: external resistor 150 600 kHz
6.4 fSYNC Buck synchronization range External clock input 150 600 kHz
6.5 fSS Spread-spectrum spreading TPS43351-Q1 only 5%
7.0 Internal Gate-Driver Supply
7.1 VREG Internal regulated supply VIN = 8 V to 18 V, EXTSUP = 0 V, SYNC = High 5.5 5.8 6.1 V
Load regulation IVREG = 0 mA to 100 mA, EXTSUP = 0 V,
SYNC = High		 0.2% 1%
7.2 VREG(EXTSUP) Internal regulated supply EXTSUP = 8.5 V 7.2 7.5 7.8 V
Load regulation IEXTSUP = 0 mA to 125 mA, SYNC = High
EXTSUP = 8.5 V to 13 V		 0.2% 1%
7.3 VEXTSUP_th EXTSUP switch-over voltage threshold IVREG = 0 mA to 100 mA ,
EXTSUP ramping positive		 4.4 4.6 4.8 V
7.4 VEXTSUP-Hys EXTSUP switch-over hysteresis 150 250 mV
7.5 IREG-Limit Current limit on VREG EXTSUP = 0 V, normal mode as well as LPM 100 400 mA
7.6 IREG_EXTSUP-Limit Current limit on VREG when using EXTSUP IVREG = 0 mA to 100 mA,
EXTSUP = 8.5 V, SYNC = High		 125 400 mA
8.0 Soft Start
8.1 ISSx Soft-start source current SSA and SSB = 0 V 0.75 1 1.25 µA
9.0 Oscillator (RT)
9.1 VRT Oscillator reference voltage 1.2 V
10.0 Power-Good / Delay
10.1 PGpullup Pullup for A and B to Sx2 50 kΩ
10.2 PGth1 Power-good threshold FBx falling –5% –7% –9%
10.3 PGhys Hysteresis 2%
10.4 PGdrop Voltage drop IPGA = 5 mA 450 mV
10.5 IPGA = 1 mA 100 mV
10.6 PGleak Leakage VSx2 = VPGx = 13 V 1 µA
10.7 tdeglitch Power-good deglitch time 2 16 µs
10.8 tdelay Reset delay External capacitor = 1 nF
VBuckX < PGth1		 1 ms
10.9 tdelay_fix Fixed reset delay No external capacitor, pin open 20 50 µs
10.10 IOH Activate current source (current to charge external capacitor) 30 40 50 µA
10.11 IIL Activate current sink (current to discharge external capacitor) 30 40 50 µA
11.0 Overtemperature Protection
11.1 Tshutdown Junction temperature shutdown threshold 150 165 °C
11.2 Thys Junction temperature hysteresis 15 °C
(1) If VBAT and VREG remain adequate, the buck can continue to operate if VIN is > 3.8 V.
(2) Quiescent current specification is non-switching current consumption without including the current in the external feedback resistor divider.
(3) The exit threshold specification is to be always higher than the entry threshold.

6.6 Power Dissipation Derating Profile, 38-Pin HTTSOP PowerPAD Package

TPS43350-Q1 TPS43351-Q1 appinfo_pwrdiss_lvsa82.gif Figure 1. Power Dissipation Derating Profile Based on High-K JEDEC PCB

6.7 Typical Characteristics

TPS43350-Q1 TPS43351-Q1 g_efficiency_across_output_currents_buck_lvsa82.gif
VIN = 12 V VOUT = 5 V fSW = 400 kHz
L = 4.7 µH RSENSE = 10 mΩ
Figure 2. Efficiency Across Output Currents (Bucks)
TPS43350-Q1 TPS43351-Q1 g_soft_start_outputs_buck_lvsa82.gif
Figure 4. Soft-Start Outputs (Buck)
TPS43350-Q1 TPS43351-Q1 g_current_limit_vs_compx_voltage_buck_lvsa82.gif
Figure 6. BUCKx Peak Current Limit vs COMPx Voltage
TPS43350-Q1 TPS43351-Q1 g_foldback_current_limit_buck_lvsa82.gif
Figure 8. Foldback Current Limit (Buck)
TPS43350-Q1 TPS43351-Q1 g_current_limit_duty_cycle_buck_lvsa82.gif
Figure 10. Current Limit vs Duty Cycle (Buck)
TPS43350-Q1 TPS43351-Q1 g_inductor_current_buck_lvsa82.gif
VIN = 12 V VOUT = 5 V fSW = 400 kHz
L = 4.7 µH RSENSE = 10 mΩ
Figure 3. Inductor Currents (Buck)
TPS43350-Q1 TPS43351-Q1 g_no_load_iq_over_temp_misc_lvsa82.gif
Figure 5. No-Load Quiescent Currentacross Temperature
TPS43350-Q1 TPS43351-Q1 g_current_sense_pins_input_current_buck_lvsa82.gif
Figure 7. Current-Sense Pins Input Current (Buck)
TPS43350-Q1 TPS43351-Q1 g_regulated_fbx_voltage_temp_buck_lvsa82.gif
Figure 9. Regulated FBx Voltage vs Temperature (Buck)