SLVSH18 December   2024 TPS4HC120-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     6
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 SNS Timing Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Pin Current and Voltage Conventions
      2. 6.3.2 Low Power Mode
      3. 6.3.3 Accurate Current Sense
      4. 6.3.4 Adjustable Current Limit
      5. 6.3.5 Inductive-Load Switching-Off Clamp
      6. 6.3.6 Fault Detection and Reporting
        1. 6.3.6.1 Diagnostic Enable Function
        2. 6.3.6.2 Multiplexing of Current Sense
        3. 6.3.6.3 FAULT Reporting
        4. 6.3.6.4 Fault Table
      7. 6.3.7 Full Diagnostics
        1. 6.3.7.1 Short-to-GND and Overload Detection
        2. 6.3.7.2 Open-Load Detection
          1. 6.3.7.2.1 Channel On
          2. 6.3.7.2.2 Channel Off
        3. 6.3.7.3 Short-to-Battery Detection
        4. 6.3.7.4 Reverse-Polarity and Battery Protection
        5. 6.3.7.5 Thermal Fault Detection
          1. 6.3.7.5.1 Thermal Protection Behavior
      8. 6.3.8 Full Protections
        1. 6.3.8.1 UVLO Protection
        2. 6.3.8.2 Loss of GND Protection
        3. 6.3.8.3 Loss of Power Supply Protection
        4. 6.3.8.4 Reverse Polarity Protection
        5. 6.3.8.5 Protection for MCU I/Os
    4. 6.4 Device Functional Modes
      1. 6.4.1 Working Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 EMC Transient Disturbances Test
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Examples
        1. 7.5.2.1 Without a GND Network
        2. 7.5.2.2 With a GND Network
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4.1 Working Mode

This device has several states to transition into based on the ENx pins, DIAG_EN pin and load conditions.

TPS4HC120-Q1 State Diagram Figure 6-24 State Diagram

SLEEP

In the SLEEP state, everything inside the device is turned off and the quiscent current is the ISLEEP. The device can only transition out of the SLEEP state if the ENx pins or DIAG_EN pin gets pulled high. From SLEEP, the device can transfer into the ACTIVE state if any of the ENx pins are pulled high, or the DIAGNOSTIC state if the DIAG_EN pin, without any of the ENx pins, goes high. Additionally, if the device is in any of the states and VBB drops below VUVLOF, the device transitions into SLEEP state.

DIAGNOSTIC

The DIAGNOSTIC state is when the device is outputting diagnostics on the SNS and FLT pins. This can happen when the device is in any previous state and the DIAG_EN pin goes high. The off-state diagnostics are comprised of open load detection in off state and short to battery detection. The FLT pin asserts if there is a fault on any of the channels, but the SNS pin only outputs a fault for the channel associated to the SELx pin values. From the DIAGNOSTIC state, the device can transfer into the ACTIVE state if the DIAG_EN pin goes back low and any channel is on or the STANDBY DELAY state if all channels are OFF.

ACTIVE

The ACTIVE state is when any of the channel outputs are on by the ENx pin associated. In the ACTIVE state, the current limit value is set by the external resistor on the ILIM pin. If the DIAG_EN pin is pulled high while in the ACTIVE state, the SNS pin outputs a proportional current to the load current of the channel associated to the SELx pins configuration until a fault occurs on that channel. Additionally the FLT pin reports if there is a fault occuring on any channel. The device can transition out of the ACTIVE state by turning off all of the channels while DIAG_EN is high or low, or a fault occurring. If all of the channels turn off and DIAG_EN is high, the device transitions into the DIAGNOSTIC state. If all of the channels turn off and the DIAG_EN pin is low, then the device transfers into the STANDBY DELAY state.

STANDBY DELAY

The STANDBY DELAY state is when the ENx pins are all low, outputs are all turned off and the DIAG_EN pin is also low but there has not yet been tSTBY amount of time. This state is included so that the channel outputs can be PWM'd without all of the internal rails being cut off and put to SLEEP mode. Once the device has waited tSTBY, the device completely shuts down and transitions into SLEEP. However, if during tSTBY, ENx were to go high, the device transitions into ACTIVE without shutting completely down. Similarly if the DIAG_EN goes high, the device transitions into DIAGNOSTIC.

LOW POWER MODE

The LOW POWER MODE state is when the channels that are active are below the ILPM,entry level for longer than tSTBY and the DIAG_EN is low. The device turns off all unnecessary internal blocks and reduces the quiescent current from IQ to IQ,LPM. The device is still protected but no diagnostics or fault reporting is possible until device comes out of this mode. For more information on Low Power Mode see Section 6.3.2.