4 Revision History
Changes from B Revision (September 2015) to C Revision
- Changed pinout diagram for compatibility with HTML versioin of the data sheetGo
- Added REFOUT specification for –1 mA ≤ IREFOUT ≤ 1 mA, condition Go
- Corrected Typical Characteristics condition statementGo
- Added Figure 4Go
- Added Figure 9Go
- Added Receiving Notification of Documentation Updates sectiionGo
Changes from A Revision (April 2012) to B Revision
- Added AEC-Q100 test guidance results for temperature grade and HBM and CDM classifications to Features listGo
- Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
- Replaced references to PowerPAD with thermal padGo
- Deleted ORDERING INFORMATION tableGo
- Deleted DISSIPATION RATINGS TABLEGo
- Changed the thermal metric parameters in the Thermal Information table Go
- Changed the test conditions for REFOUT source and sink current limits in the Electrical Characteristics table Go
- Added -Q1 to device name throughout text of documentGo
Changes from * Revision (November 2009) to A Revision
- Added thermal table information for DRC package.Go