SLUS812D
February 2008 – February 2020
TPS51200
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Simplified DDR Application
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Sink and Source Regulator (VO Pin)
7.3.2
Reference Input (REFIN Pin)
7.3.3
Reference Output (REFOUT Pin)
7.3.4
Soft-Start Sequencing
7.3.5
Enable Control (EN Pin)
7.3.6
Powergood Function (PGOOD Pin)
7.3.7
Current Protection (VO Pin)
7.3.8
UVLO Protection (VIN Pin)
7.3.9
Thermal Shutdown
7.3.10
Tracking Start-up and Shutdown
7.3.11
Output Tolerance Consideration for VTT DIMM Applications
7.3.12
REFOUT (VREF) Consideration for DDR2 Applications
7.4
Device Functional Modes
7.4.1
Low Input Voltage Applications
7.4.2
S3 and Pseudo-S5 Support
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Input Voltage Capacitor
8.2.2.2
VLDO Input Capacitor
8.2.2.3
Output Capacitor
8.2.3
Application Curves
8.3
System Examples
8.3.1
3.3-VIN, DDR2 Configuration
8.3.2
2.5-VIN, DDR3 Configuration
8.3.3
3.3-VIN, LP DDR3 or DDR4 Configuration
8.3.4
3.3-VIN, DDR3 Tracking Configuration
8.3.5
3.3-VIN, LDO Configuration
8.3.6
3.3-VIN, DDR3 Configuration with LFP
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
10.3
Thermal Design Considerations
11
Device and Documentation Support
11.1
Device Support
11.1.1
Third-Party Products Disclaimer
11.1.2
Development Support
11.1.2.1
Evaluation Modules
11.1.2.2
Spice Models
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Community Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DRC|10
MPDS117L
Thermal pad, mechanical data (Package|Pins)
DRC|10
QFND013N
Orderable Information
slus812d_oa
slus812d_pm
6.6
Typical Characteristics
3 × 10-µF MLCCs (0805) are used on the output
V
VIN
= 3.3 V
DDR
Figure 1.
Load Regulation
V
VIN
= 3.3 V
DDR3
Figure 3.
Load Regulation
V
VIN
= 3.3 V
LP DDR3 or DDR4
Figure 5.
Load Regulation
V
VIN
= 2.5 V
DDR2
Figure 7.
Load Regulation
V
VIN
= 2.5 V
DDR3L
Figure 9.
Load Regulation
DDR
Figure 11.
REFOUT Load Regulation
DDR3
Figure 13.
REFOUT Load Regulation
LP DDR3 or DDR4
Figure 15.
REFOUT Load Regulation
DDR2
Figure 17.
Bode Plot
V
VIN
= 3.3 V
DDR2
Figure 2.
Load Regulation
V
VIN
= 3.3 V
DDR3L
Figure 4.
Load Regulation
V
VIN
= 2.5 V
DDR
Figure 6.
Load Regulation
V
VIN
= 2.5 V
DDR3
Figure 8.
Load Regulation
V
VIN
= 2.5 V
LP DDR3 or DDR4
Figure 10.
Load Regulation
DDR2
Figure 12.
REFOUT Load Regulation
DDR3L
Figure 14.
REFOUT Load Regulation
Figure 16.
DROPOUT Voltage vs. Output Current
DDR3
Figure 18.
Bode Plot