SLUSFR0A July   2024  – August 2024 TPS51375

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  PWM Operation and D-CAP3™ Control Mode
      2. 6.3.2  Remote Sense
      3. 6.3.3  Body Braking
      4. 6.3.4  5V LDO and BYP Function
      5. 6.3.5  Soft Start
      6. 6.3.6  Large Duty Operation
      7. 6.3.7  Power Good
      8. 6.3.8  Overcurrent Protection and Undervoltage Protection
      9. 6.3.9  Overvoltage Protection
      10. 6.3.10 UVLO Protection
      11. 6.3.11 Output Voltage Discharge
      12. 6.3.12 Standby Operation
      13. 6.3.13 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Advanced Eco-mode Control
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 External Component Selection
          1. 7.2.2.2.1 Remote Sense Amplifier and Adjusting the Output Voltage
          2. 7.2.2.2.2 Inductor Selection
          3. 7.2.2.2.3 Output Capacitor Selection
          4. 7.2.2.2.4 Input Capacitor Selection
          5. 7.2.2.2.5 Bootstrap Capacitor Selection
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TPS51375 UNIT
VBH (WQFN-HR)
19 PINS
RθJA Junction-to-ambient thermal resistance 67.7 °C/W
RθJA_effective Junction-to-ambient thermal resistance (4-layer custom board)(2) 30 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 18.2 °C/W
RθJB Junction-to-board thermal resistance 20.1 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 20 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) The effective RθJA is simulated based on TPS51375EVM.