SLUSF03 august   2023 TPS51385

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PWM Operation and D-CAP3™ Control Mode
      2. 7.3.2  VCC LDO
      3. 7.3.3  Soft Start
      4. 7.3.4  Enable Control
      5. 7.3.5  Power Good
      6. 7.3.6  Overcurrent Protection and Undervoltage Protection
      7. 7.3.7  UVLO Protection
      8. 7.3.8  Overvoltage Protection
      9. 7.3.9  Output Voltage Discharge
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 MODE Pin
      2. 7.4.2 Out-of-Audio™ Mode
      3. 7.4.3 Power Save Mode (PSM)
  9. 8  Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Component Selection
          1. 8.2.2.1.1 Inductor Selection
          2. 8.2.2.1.2 Output Capacitor Selection
          3. 8.2.2.1.3 Input Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)DEVICEUNIT
RJNR (QFN, JEDEC)RJNR (QFN, TI EVM)
12 PINS12 PINS
RθJAJunction-to-ambient thermal resistance72.737.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance50.1Not Applicable (2)°C/W
RθJBJunction-to-board thermal resistance18.7Not Applicable (2)°C/W
ψJTJunction-to-top characterization parameter1.83.7°C/W
ψJBJunction-to-board characterization parameter18.418.5°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The thermal simulation setup is not applicable to a TI EVM layout.