SLUSAU4B DECEMBER   2011  – February 2019 TPS53219A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Enable and Soft-Start
      2. 7.3.2  Adaptive ON-Time D-CAP Control and Frequency Selection
      3. 7.3.3  Small Signal Model
      4. 7.3.4  Ramp Signal
      5. 7.3.5  Adaptive Zero Crossing
      6. 7.3.6  Output Discharge Control
      7. 7.3.7  Low-Side Driver
      8. 7.3.8  High-Side Driver
      9. 7.3.9  Power Good
      10. 7.3.10 Current Sense and Overcurrent Protection
      11. 7.3.11 Overvoltage and Undervoltage Protection
      12. 7.3.12 UVLO Protection
      13. 7.3.13 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Light Load Condition in Auto-Skip Operation
      2. 7.4.2 Forced Continuous Conduction Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application With Power Block
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 External Components Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application With Ceramic Output Capacitors
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 External Parts Selection With All Ceramic Output Capacitors
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS53219A UNIT
RGT (QFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 51.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 85.4 °C/W
RθJB Junction-to-board thermal resistance 20.1 °C/W
ψJT Junction-to-top characterization parameter 1.3 °C/W
ψJB Junction-to-board characterization parameter 19.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.