SLUSAE6B December   2010  – November 2023 TPS53315

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  D-CAP™ Integrated Circuit with Adaptive On-Time
      2. 6.3.2  Small Signal Model
      3. 6.3.3  Ramp Signal
      4. 6.3.4  Auto-Skip Eco-mode Light Load Operation
      5. 6.3.5  Adaptive Zero Crossing
      6. 6.3.6  Forced Continuous Conduction Mode
      7. 6.3.7  Power Good
      8. 6.3.8  Current Sense and Overcurrent Protection
      9. 6.3.9  Overvoltage and Undervoltage Protection
      10. 6.3.10 UVLO Protection
      11. 6.3.11 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Enable and Soft Start
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Typical Application Circuit Diagram
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Step 1: Select Operation Mode and Soft-Start Time
          2. 7.2.1.2.2 Step 2: Select Switching Frequency
          3. 7.2.1.2.3 Step 3: Select the Inductance
          4. 7.2.1.2.4 Step 4: Select Output Capacitors
          5. 7.2.1.2.5 Step 5: Determine the Voltage-Divider Resistance (R1 and R2)
          6. 7.2.1.2.6 Step 6: Select the Overcurrent Resistance (RTRIP)
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Typical Application Circuit Diagram With Ceramic Output Capacitors
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Step 1: Select Operation Mode and Soft-Start Time
          2. 7.2.2.2.2 Step 2: Select Switching Frequency
          3. 7.2.2.2.3 Step 3: Select the Inductance
          4. 7.2.2.2.4 Step 4: Select Output Capacitance for Ceramic Capacitors
          5. 7.2.2.2.5 Step 5: Select the Overcurrent Setting Resistance (RTRIP)
        3. 7.2.2.3 External Component Selection When Using All Ceramic Output Capacitors
        4. 7.2.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Layout Guidelines

Certain points must be considered before starting a layout work using the TPS53315.

  • Place the power components (including input, output capacitors, inductor and TPS53315) on one side of the PCB (solder side). Place other small signal components on another side (component side). At least one inner plane must be inserted, connected to ground, to shield and isolate the small signal traces from noisy power lines.
  • Place all sensitive analog traces and components such as VFB, PGOOD, TRIP, MODE and RF away from high-voltage switching nodes such as LL, VBST to avoid coupling. Use internal layers as ground planes and shield feedback trace from power traces and components.
  • Place the VIN decoupling capacitors as close to the VIN and PGND pins as possible to minimize the input AC current loop.
  • Connect the top-side resistor of the voltage divider to the positive node of VOUT capacitor because the TPS53315 controls output voltage referring to voltage across the VOUT capacitor. In a same manner both bottom side resistor and GND pad of the device must be connected to the negative node of VOUT capacitor. The trace from these resistors to the VFB pin must be short and thin. Place on the component side and avoid vias between these resistors and the device.
  • Connect the overcurrent setting resistors from TRIP pin to ground and make the connections as close as possible to the device. The trace from TRIP pin to resistor and from resistor to ground must avoid coupling to a high-voltage switching node.
  • Connect the frequency setting resistor from RF pin to ground, or to the VREG pin, and make the connections as close as possible to the device. The trace from the RF pin to the resistor and from the resistor to ground must avoid coupling to a high-voltage switching node.
  • Connect the MODE setting resistor from MODE pin to ground, or to the PGOOD pin, and make the connections as close as possible to the device. The trace from the MODE pin to the resistor and from the resistor to ground must avoid coupling to a high-voltage switching node.
  • Make the PCB trace defined as switch node, which connects the LL pins and high-voltage side of the inductor, as short and wide as possible.