SLUSAE5G August   2011  – April 2021 TPS53355

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Infomation
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 5-V LDO and VREG Start-Up
      2. 7.3.2 Adaptive On-Time D-CAP Control and Frequency Selection
      3. 7.3.3 Ramp Signal
      4. 7.3.4 Adaptive Zero Crossing
      5. 7.3.5 Power-Good
      6. 7.3.6 Current Sense, Overcurrent and Short Circuit Protection
      7. 7.3.7 Overvoltage and Undervoltage Protection
      8. 7.3.8 UVLO Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable, Soft Start, and Mode Selection
      2. 7.4.2 Auto-Skip Eco-mode™ Light Load Operation
      3. 7.4.3 Forced Continuous Conduction Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Small Signal Model
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application Circuit Diagram with Ceramic Output Capacitors
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 External Component Selection
          3. 8.2.1.2.3 External Component Selection Using All Ceramic Output Capacitors
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application Circuit
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 External Component Selection
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQP|22
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Infomation

THERMAL METRIC(1)TPS53355UNIT
DQPVQP
22 PINS22 PINS
θJAJunction-to-ambient thermal resistance27.227.2°C/W
θJCtopJunction-to-case (top) thermal resistance17.117.1°C/W
θJBJunction-to-board thermal resistance5.95.9°C/W
ψJTJunction-to-top characterization parameter0.80.8°C/W
ψJBJunction-to-board characterization parameter5.85.8°C/W
θJCbotJunction-to-case (bottom) thermal resistance1.21.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.