SLUSCX9 March 2017 TPS53627
PRODUCTION DATA.
- 1Features
- 2Applications
- 3Description
- 4Revision History
- 5Device and Documentation Support
- 6Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
- RSM|32
Thermal pad, mechanical data (Package|Pins)
- RSM|32
Orderable Information
5 Device and Documentation Support
5.1 Documentation Support
5.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
5.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
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TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
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Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
5.4 Trademarks
Power Stage, AutoBalance, PowerPad, D-CAP+, NexFET, E2E are trademarks of Texas Instruments.
Intel is a registered trademark of Intel Corporation.
All other trademarks are the property of their respective owners.
5.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
5.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.