SLVSAB0B December   2010  – November 2014 TPS5401

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Slope Compensation Output Current
      3. 7.3.3  Low-Dropout Operation and Bootstrap Voltage (BOOT)
      4. 7.3.4  Error Amplifier
      5. 7.3.5  Voltage Reference
      6. 7.3.6  Adjusting the Output Voltage
      7. 7.3.7  Enabling and Adjusting Undervoltage Lockout
      8. 7.3.8  Slow-Start/Tracking Pin (SS/TR)
      9. 7.3.9  Overload Recovery Circuit
      10. 7.3.10 Sequencing
      11. 7.3.11 Constant Switching Frequency and Timing Resistor (RT/CLK Pin)
      12. 7.3.12 Overcurrent Protection and Frequency Shift
      13. 7.3.13 Selecting the Switching Frequency
      14. 7.3.14 How to Interface to RT/CLK Pin
      15. 7.3.15 Power Good (PWRGD Pin)
      16. 7.3.16 Overvoltage Transient Protection
      17. 7.3.17 Thermal Shutdown
      18. 7.3.18 Current-Mode Compensation Design
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pulse-Skip Eco-mode Control Scheme
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Switching Frequency
        2. 8.2.2.2  Output Voltage Setpoint
        3. 8.2.2.3  Input Capacitor
        4. 8.2.2.4  Output Inductor Selection
        5. 8.2.2.5  Output Capacitor
        6. 8.2.2.6  Catch Diode
        7. 8.2.2.7  Slow-Start Capacitor
        8. 8.2.2.8  Bootstrap Capacitor Selection
        9. 8.2.2.9  Undervoltage Lockout Set Point
        10. 8.2.2.10 Compensation
        11. 8.2.2.11 Discontinuous Mode and Eco-mode Control-Scheme Boundary
        12. 8.2.2.12 Power Dissipation Estimate
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Estimated Circuit Area
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
      2. 11.1.2 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

11.1.2 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

  • Semiconductor and IC Package Thermal Metrics (SPRA953).
  • TPS54040 0.5-A, 42V Step Down DC/DC Converter with Eco-Mode data sheet (SLVS918).

11.3 Trademarks

Eco-mode, PowerPAD are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.