SLVSB10F July   2012  – November 2020 TPS54020

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings (1)
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed Frequency PWM Control
      2. 8.3.2  Input Voltage and Power Input Voltage Pins (VIN and PVIN)
      3. 8.3.3  Voltage Reference (VREF)
      4. 8.3.4  Adjusting the Output Voltage
      5. 8.3.5  Safe Start-up into Prebiased Outputs
      6. 8.3.6  Error Amplifier
      7. 8.3.7  Slope Compensation
      8. 8.3.8  Enable and Adjusting Undervoltage Lockout
      9. 8.3.9  Adjustable Switching Frequency and Synchronization (RT/CLK)
      10. 8.3.10 Soft-Start (SS) Sequence
      11. 8.3.11 Power Good (PWRGD)
      12. 8.3.12 Bootstrap Voltage (BOOT) and Low Dropout Operation
      13. 8.3.13 Sequencing (SS)
      14. 8.3.14 Output Overvoltage Protection (OVP)
      15. 8.3.15 Overcurrent Protection
        1. 8.3.15.1 High-side MOSFET Overcurrent Protection
        2. 8.3.15.2 Low-side MOSFET Overcurrent Protection
      16. 8.3.16 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Single-Supply Operation
      2. 8.4.2 Split Rail Operation
      3. 8.4.3 Continuous Current Mode Operation (CCM)
      4. 8.4.4 Eco-mode Light-Load Efficiency Operation
      5. 8.4.5 Adjustable Switching Frequency (RT Mode)
      6. 8.4.6 Synchronization (CLK Mode)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Small Signal Model for Loop Response
      2. 9.1.2 Simple Small Signal Model for Peak Current Mode Control
      3. 9.1.3 Small Signal Model for Frequency Compensation
      4. 9.1.4 Designing the Device Loop Compensation
        1. 9.1.4.1 Step One: Determine the Crossover Frequency (fC)
        2. 9.1.4.2 Step Two: Determine a Value for R6
        3. 9.1.4.3 Step Three: Calculate the Compensation Zero.
        4. 9.1.4.4 Step Four: Calculate the Compensation Noise Pole.
        5. 9.1.4.5 Step Five: Calculate the Compensation Phase Boost Zero.
      5. 9.1.5 Fast Transient Considerations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Custom Design With WEBENCH® Tools
        2. 9.2.2.2  Operating Frequency
        3. 9.2.2.3  Output Inductor Selection
        4. 9.2.2.4  Output Capacitor Selection
          1. 9.2.2.4.1 Response to a Load Transient
          2. 9.2.2.4.2 Output Voltage Ripple
          3. 9.2.2.4.3 Bus Capacitance
        5. 9.2.2.5  Input Capacitor Selection
        6. 9.2.2.6  Soft-Start Capacitor Selection
        7. 9.2.2.7  Bootstrap Capacitor Selection
        8. 9.2.2.8  Undervoltage Lockout Set Point
        9. 9.2.2.9  Output Voltage Feedback Resistor Selection
          1. 9.2.2.9.1 Minimum Output Voltage
        10. 9.2.2.10 Compensation Component Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
9.2.2.4.2 Output Voltage Ripple

The output voltage ripple is the second criteria. Equation 23 calculates the minimum output capacitance required to meet the output voltage ripple specification.

Equation 23. GUID-0175C800-E132-481A-972D-FCDEBC38276C-low.gif

where

  • fSW is the switching frequency
  • VRIPPLE is the maximum allowable output voltage ripple
  • IRIPPLE is the inductor ripple current.

In this case, the maximum output voltage ripple is 10 mV. Under this requirement, the minimum output capacitance for ripple (as calculated in Equation 24) yields 80.5 µF. Equation 24 calculates the maximum ESR an output capacitor can have to meet the output voltage ripple specification. Equation 24 indicates the ESR should be less than 3 mΩ, and this is the requirement when the impedance of the output capacitance is dominated by ESR, such as with an electrolytic capacitor. However, because the output voltage ripple is a combination of capacitive ripple and resistive ripple, the ESR must be much lower than this result when the capacitance is purely ceramic. This is because the lower capacitance values obtained with ceramic capacitors will result in a larger capacitive ripple component of the total ripple.

Equation 24. GUID-93454357-BB23-4E26-91DE-646C4B61CB76-low.gif

Additional capacitance de-ratings for aging, temperature, and DC bias should be factored in, which increases the minimum required capacitance value. For this design example, three 100-μF, 6.3-V, X5R, ceramic capacitors with 2 mΩ each of ESR were selected. Capacitors generally have limits to the amount of ripple current they can handle without failing or producing excess heat. An output capacitor that can support the inductor ripple current must be specified. Some capacitor data sheets specify the RMS (root mean square) value of the maximum ripple current. Equation 25 can be used to calculate the RMS ripple current the output capacitor needs to support. For this application, Equation 25 yields 929 mA.

Equation 25. GUID-1F53FBF3-67C6-48DD-B6FC-AB754EB324B3-low.gif