SLVS675E August   2006  – January 2024 TPS5410

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information 
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Oscillator Frequency
      2. 6.3.2  Voltage Reference
      3. 6.3.3  Enable (ENA) and Internal Slow-Start
      4. 6.3.4  Undervoltage Lockout (UVLO)
      5. 6.3.5  Boost Capacitor (BOOT)
      6. 6.3.6  Output Feedback (VSENSE)
      7. 6.3.7  Internal Compensation
      8. 6.3.8  Voltage Feed-Forward
      9. 6.3.9  Pulse-Width-Modulation (PWM) Control
      10. 6.3.10 Overcurrent Limiting
      11. 6.3.11 Overvoltage Protection
      12. 6.3.12 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Minimum Input Voltage
      2. 6.4.2 ENA Control
  8. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Application Circuit
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Switching Frequency
          2. 7.2.1.2.2 Input Capacitors
          3. 7.2.1.2.3 Output Filter Components
            1. 7.2.1.2.3.1 Inductor Selection
            2. 7.2.1.2.3.2 Capacitor Selection
          4. 7.2.1.2.4 Output Voltage Setpoint
          5. 7.2.1.2.5 Boot Capacitor
          6. 7.2.1.2.6 Catch Diode
          7. 7.2.1.2.7 Advanced Information
            1. 7.2.1.2.7.1 Output Voltage Limitations
            2. 7.2.1.2.7.2 Internal Compensation Network
            3. 7.2.1.2.7.3 Thermal Calculations
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Using All Ceramic Capacitors
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Output Filter Capacitor Selection
          2. 7.2.2.2.2 External Compensation Network
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision D (November 2014) to Revision E (January 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated to new format which does not include specific parameter names and does include min and max columns; TJ called out in header Pin names are used rather than signal names; BOOT and PH voltages now marked as output voltage; Footnotes updated and Note 2 removed.Go
  • Changed BOOT to PH Absolute Maximum to 6 V maximumGo
  • Changed CDM ESD to ±750 VGo
  • Added Recommended operating VI input voltageGo
  • Updated footnotes to match current TI standards, replaced custom board specifications with EVM information and JEDEC standard information.Go
  • Changed RθJC(top), RθJB, ψJT, ψJB Go
  • Added condition for typical specifications EC table’s header, added parameter names, and used pin names in parameter descriptions.  Footnote added.Go
  • Updated the following test conditions: VFB, DMAX, and RDSON(HS).Go
  • Updated the following typical specifications in the EC table: IQ(VIN), ISD(VIN), VINUVLO(H), VEN(H), and RDSON(HS).Go
  • Updated typical and maximum ISH(OC) in the EC tableGo

Changes from Revision C (September 2013) to Revision D (November 2014)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from Revision B (January 2013) to Revision C (September 2013)

  • Deleted SWIFT from the data sheet Title, Features, and DescriptionGo
  • Deleted Features List Item "For SWIFT Documentation, "Go
  • Deleted text from the description "As a member of the SWIFT™ family of DC regulators"Go
  • Updated the following test conditions: VFB, DMAX, and RDSON(HS).Go