SLUSCO8B November   2016  – June 2018 TPS54200 , TPS54201

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Excellent Deep Dimming in ADIM
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed-Frequency PWM Control
      2. 8.3.2  Error Amplifier
      3. 8.3.3  Slope Compensation and Output Current
      4. 8.3.4  Input Undervoltage Lockout
      5. 8.3.5  Voltage Reference
      6. 8.3.6  Setting LED Current
      7. 8.3.7  Internal Soft Start
      8. 8.3.8  Bootstrap Voltage (BOOT)
      9. 8.3.9  Overcurrent Protection
        1. 8.3.9.1 High-Side MOSFET Overcurrent Protection
        2. 8.3.9.2 Low-Side MOSFET Overcurrent Protection
        3. 8.3.9.3 Low-Side MOSFET Reverse Overcurrent Protection
      10. 8.3.10 Fault Protection
        1. 8.3.10.1 LED-Open Protection
        2. 8.3.10.2 LED Short Protection
        3. 8.3.10.3 Sense-Resistor Short Protection
        4. 8.3.10.4 Sense-Resistor Open Protection
        5. 8.3.10.5 Overvoltage Protection
        6. 8.3.10.6 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable Device
      2. 8.4.2 Mode Detection
      3. 8.4.3 Analog Dimming Mode Operation
      4. 8.4.4 PWM Dimming-Mode Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 TPS5420x 12-V Input, 1.5-A, 3-Piece IR LED Driver With Analog Dimming
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Inductor Selection
          2. 9.2.1.2.2 Input Capacitor Selection
          3. 9.2.1.2.3 Output Capacitor Selection
          4. 9.2.1.2.4 FB Pin RC Filter Selection
          5. 9.2.1.2.5 Sense Resistor Selection
        3. 9.2.1.3 Application Curves
      2. 9.2.2 TPS5420x 24-V Input, 1-A, 4-Piece WLED Driver With PWM Dimming
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Inductor Selection
          2. 9.2.2.2.2 Input Capacitor Selection
          3. 9.2.2.2.3 Output Capacitor Selection
          4. 9.2.2.2.4 FB Pin RC Filter Selection
          5. 9.2.2.2.5 Sense Resistor Selection
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

An example of a proper layout for the TPS5420x is shown in Figure 50.

  • Creating a large GND plane for good electrical and thermal performance is important.
  • The VIN and GND traces should be as wide as possible to reduce trace impedance. The added width also provides excellent heat dissipation.
  • Thermal vias can be used to connect the topside GND plane to additional printed-circuit board (PCB) layers for heat dissipation and grounding.
  • The input capacitors must be located as close as possible to the VIN pin and the GND pin.
  • The SW trace must be kept as short as possible to minimize radiated noise and EMI.
  • Do not allow switching current to flow under the device.
  • The FB trace should be kept as short as possible and placed away from the high-voltage switching trace and the ground shield.
  • In higher-current applications, routing the load current of the current-sense resistor to the junction of the input capacitor and GND node may be necessary.