SLVSD26B April   2016  – April 2021 TPS54202

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency PWM Control
      2. 7.3.2  Pulse Skip Mode
      3. 7.3.3  Error Amplifier
      4. 7.3.4  Slope Compensation and Output Current
      5. 7.3.5  Enable and Adjusting Under Voltage Lockout
      6. 7.3.6  Safe Startup into Pre-Biased Outputs
      7. 7.3.7  Voltage Reference
      8. 7.3.8  Adjusting Output Voltage
      9. 7.3.9  Internal Soft-Start
      10. 7.3.10 Bootstrap Voltage (BOOT)
      11. 7.3.11 Overcurrent Protection
        1. 7.3.11.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.11.2 Low-Side MOSFET Overcurrent Protection
      12. 7.3.12 Spread Spectrum
      13. 7.3.13 Output Overvoltage Protection (OVP)
      14. 7.3.14 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Eco-mode Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 TPS54202 8-V to 28-V Input, 5-V Output Converter
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Input Capacitor Selection
        2. 8.2.3.2 Bootstrap Capacitor Selection
        3. 8.2.3.3 Output Voltage Set Point
        4. 8.2.3.4 Undervoltage Lockout Set Point
        5. 8.2.3.5 Output Filter Components
          1. 8.2.3.5.1 Inductor Selection
          2. 8.2.3.5.2 Output Capacitor Selection
          3. 8.2.3.5.3 Feed-Forward Capacitor
      4. 8.2.4 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.