SLVSD26B April   2016  – April 2021 TPS54202

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency PWM Control
      2. 7.3.2  Pulse Skip Mode
      3. 7.3.3  Error Amplifier
      4. 7.3.4  Slope Compensation and Output Current
      5. 7.3.5  Enable and Adjusting Under Voltage Lockout
      6. 7.3.6  Safe Startup into Pre-Biased Outputs
      7. 7.3.7  Voltage Reference
      8. 7.3.8  Adjusting Output Voltage
      9. 7.3.9  Internal Soft-Start
      10. 7.3.10 Bootstrap Voltage (BOOT)
      11. 7.3.11 Overcurrent Protection
        1. 7.3.11.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.11.2 Low-Side MOSFET Overcurrent Protection
      12. 7.3.12 Spread Spectrum
      13. 7.3.13 Output Overvoltage Protection (OVP)
      14. 7.3.14 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Eco-mode Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 TPS54202 8-V to 28-V Input, 5-V Output Converter
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Input Capacitor Selection
        2. 8.2.3.2 Bootstrap Capacitor Selection
        3. 8.2.3.3 Output Voltage Set Point
        4. 8.2.3.4 Undervoltage Lockout Set Point
        5. 8.2.3.5 Output Filter Components
          1. 8.2.3.5.1 Inductor Selection
          2. 8.2.3.5.2 Output Capacitor Selection
          3. 8.2.3.5.3 Feed-Forward Capacitor
      4. 8.2.4 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.14 Thermal Shutdown

The internal thermal-shutdown circuitry forces the device to stop switching if the junction temperature exceeds 155°C typically. When the junction temperature drops below 145°C typically, the internal thermal-hiccup timer begins to count. The device reinitiates the power-up sequence after the built-in thermal-shutdown hiccup time (32768 cycles) is over.