The TPS54260 device is a 60-V, 2.5-A, step-down regulator with an integrated high-side MOSFET. Current mode control provides simple external compensation and flexible component selection. A low-ripple, pulse skip mode reduces the no load, regulated output supply current to 138 μA. Using the enable pin, shutdown supply current is reduced to
1.3 μA, when the enable pin is low.
Undervoltage lockout (UVLO) is internally set at
2.5 V, but can be increased using the enable pin. The output voltage startup ramp is controlled by the slow-start pin that can also be configured for sequencing and tracking. An open-drain powergood signal indicates the output is within 94% to 107% of its nominal voltage.
A wide switching frequency range allows efficiency and external component size to be optimized. Frequency foldback and thermal shutdown protects the part during an overload condition.
The TPS54260 is available in 10-pin thermally enhanced MSOP and 10-pin 3-mm × 3-mm SON PowerPAD packages.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TPS54260 | HVSSOP (10) | 3.00 mm × 3.00 mm |
VSON (10) | 3.00 mm × 3.00 mm |
Changes from C Revision (May 2016) to D Revision
Changes from B Revision (December 2014) to C Revision
Changes from A Revision (December 2010) to B Revision
Changes from * Revision (March 2010) to A Revision
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±500 |
MIN | MAX | UNIT | ||
---|---|---|---|---|
VI | Input supply voltage | 3.5 | 60 | V |
IO | Output current | 2.5 | A | |
TJ | Operating junction temperature | –40 | 150 | °C |
THERMAL METRIC(1)(2) | TPS54260 | UNIT | ||
---|---|---|---|---|
DGQ (HVSOP) | DRC (VSON) | |||
10 PINS | 10 PINS | |||
RθJA | Junction-to-ambient thermal resistance (standard board) | 62.5 | 40 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 83 | 65 | °C/W |
RθJB | Junction-to-board thermal resistance | 28 | 8 | °C/W |
ψJT | Junction-to-top characterization parameter | 1.7 | 0.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 20.1 | 7.5 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 21 | 7.8 | °C/W |