SLUS973A October   2009  – November 2016 TPS54290 , TPS54291 , TPS54292

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Voltage Reference
      2. 8.3.2  Oscillator
      3. 8.3.3  Input UVLO and Start-Up
      4. 8.3.4  Enable and Timed Turnon of the Outputs
      5. 8.3.5  Soft Start
      6. 8.3.6  Output Voltage Regulation
      7. 8.3.7  Inductor Selection
      8. 8.3.8  Maximum Output Capacitance
      9. 8.3.9  Feedback Loop Compensation
      10. 8.3.10 Bootstrap for N-Channel MOSFET
      11. 8.3.11 Output Overload Protection
      12. 8.3.12 Operating Near Maximum Duty Cycle
      13. 8.3.13 Dual-Supply Operation
      14. 8.3.14 Bypassing and Filtering
    4. 8.4 Device Functional Modes
      1. 8.4.1 PWM Operation
      2. 8.4.2 Standby Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 TPS54291 Design Example
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Duty Cycle Estimation
          2. 9.2.1.2.2  Inductor Selection
          3. 9.2.1.2.3  Output Capacitor Selection
          4. 9.2.1.2.4  Input Capacitor Selection
          5. 9.2.1.2.5  Feedback
          6. 9.2.1.2.6  Compensation Components
          7. 9.2.1.2.7  Compensation Gain Setting Resistor
          8. 9.2.1.2.8  Compensation Integrator Capacitor
          9. 9.2.1.2.9  Bootstrap Capacitor
          10. 9.2.1.2.10 Power Dissipation
        3. 9.2.1.3 Application Curves
      2. 9.2.2 TPS54290 Cascaded Design Example
        1. 9.2.2.1 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PowerPAD™ Package
    2. 11.2 Layout Examples
    3. 11.3 Overtemperature Protection and Junction Temperature Rise
    4. 11.4 Power Derating
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (October 2009) to A Revision

  • Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Ordering Information table; see POA at the end of the data sheetGo
  • Deleted Lead temperature (260°C maximum)Go
  • Added Thermal Information table to replace the Package Dissipation Ratings tableGo