SLUS973A October   2009  – November 2016 TPS54290 , TPS54291 , TPS54292

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Voltage Reference
      2. 8.3.2  Oscillator
      3. 8.3.3  Input UVLO and Start-Up
      4. 8.3.4  Enable and Timed Turnon of the Outputs
      5. 8.3.5  Soft Start
      6. 8.3.6  Output Voltage Regulation
      7. 8.3.7  Inductor Selection
      8. 8.3.8  Maximum Output Capacitance
      9. 8.3.9  Feedback Loop Compensation
      10. 8.3.10 Bootstrap for N-Channel MOSFET
      11. 8.3.11 Output Overload Protection
      12. 8.3.12 Operating Near Maximum Duty Cycle
      13. 8.3.13 Dual-Supply Operation
      14. 8.3.14 Bypassing and Filtering
    4. 8.4 Device Functional Modes
      1. 8.4.1 PWM Operation
      2. 8.4.2 Standby Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 TPS54291 Design Example
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Duty Cycle Estimation
          2. 9.2.1.2.2  Inductor Selection
          3. 9.2.1.2.3  Output Capacitor Selection
          4. 9.2.1.2.4  Input Capacitor Selection
          5. 9.2.1.2.5  Feedback
          6. 9.2.1.2.6  Compensation Components
          7. 9.2.1.2.7  Compensation Gain Setting Resistor
          8. 9.2.1.2.8  Compensation Integrator Capacitor
          9. 9.2.1.2.9  Bootstrap Capacitor
          10. 9.2.1.2.10 Power Dissipation
        3. 9.2.1.3 Application Curves
      2. 9.2.2 TPS54290 Cascaded Design Example
        1. 9.2.2.1 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PowerPAD™ Package
    2. 11.2 Layout Examples
    3. 11.3 Overtemperature Protection and Junction Temperature Rise
    4. 11.4 Power Derating
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

These references, including design software, design tools, and links to additional references, may be found at www.power.ti.com.

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 3. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS54290 Click here Click here Click here Click here Click here
TPS54291 Click here Click here Click here Click here Click here
TPS54292 Click here Click here Click here Click here Click here

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.5 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.