SNVSBU2C September   2020  – December 2021 TPS542A52

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Enable and Adjustable Undervoltage Lockout
      2. 7.3.2  Input and VREG Undervoltage Lockout Protection
      3. 7.3.3  Voltage Reference and Setting the Output Voltage
      4. 7.3.4  Remote Sense Function
      5. 7.3.5  Switching Frequency
      6. 7.3.6  Voltage Control Mode Internal Compensation
      7. 7.3.7  Soft Start and Prebiased Output Start-up
      8. 7.3.8  Power Good
      9. 7.3.9  Overvoltage and Undervoltage Protection
      10. 7.3.10 Overcurrent Protection
      11. 7.3.11 High-Side FET Throttling
      12. 7.3.12 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pulse-Frequency Modulation Eco-mode Light Load Operation
      2. 7.4.2 Forced Continuous-Conduction Mode
      3. 7.4.3 Soft Start
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Full Analog Configuration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2  Output Voltage Calculation
          3. 8.2.1.2.3  Switching Frequency Selection
          4. 8.2.1.2.4  Inductor Selection
          5. 8.2.1.2.5  Input Capacitor Selection
          6. 8.2.1.2.6  Bootstrap Capacitor Selection
          7. 8.2.1.2.7  R-C Snubber and VIN Pin High-Frequency Bypass
          8. 8.2.1.2.8  Output Capacitor Selection
          9. 8.2.1.2.9  Response to a Load Transient
          10. 8.2.1.2.10 Pin-Strap Setting
        3. 8.2.1.3 Application Curves
        4. 8.2.1.4 Typical Application Circuits
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.