SLUSCV2A June   2017  – April 2021 TPS54308

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency PWM Control
      2. 7.3.2  Force Continuous Conduction Mode (FCCM)
      3. 7.3.3  Error Amplifier
      4. 7.3.4  Slope Compensation and Output Current
      5. 7.3.5  Enable and Adjusting Undervoltage Lockout
      6. 7.3.6  Safe Start-Up into Pre-Biased Outputs
      7. 7.3.7  Voltage Reference
      8. 7.3.8  Adjusting Output Voltage
      9. 7.3.9  Internal Soft Start
      10. 7.3.10 Bootstrap Voltage (BOOT)
      11. 7.3.11 Overcurrent Protection
        1. 7.3.11.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.11.2 Low-Side MOSFET Overcurrent Protection
      12. 7.3.12 Output Overvoltage Protection (OVP)
      13. 7.3.13 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 TPS54308 8-V to 28-V Input, 5-V Output Converter
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Custom Design With WEBENCH® Tools
        2. 8.2.3.2 Input Capacitor Selection
        3. 8.2.3.3 Bootstrap Capacitor Selection
        4. 8.2.3.4 Output Voltage Set Point
        5. 8.2.3.5 Undervoltage Lockout Set Point
        6. 8.2.3.6 Output Filter Components
          1. 8.2.3.6.1 Inductor Selection
          2. 8.2.3.6.2 Output Capacitor Selection
          3. 8.2.3.6.3 Feedforward Capacitor
      4. 8.2.4 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TPS54308UNIT
DDC (SOT-23)
6 PINS
RθJAJunction-to-ambient thermal resistance87.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance35.5°C/W
RθJBJunction-to-board thermal resistance14.4°C/W
ψJTJunction-to-top characterization parameter0.9°C/W
ψJBJunction-to-board characterization parameter14.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.