SLVS632K January   2006  – January 2024 TPS5430 , TPS5431

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information (DDA Package)
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Oscillator Frequency
      2. 6.3.2  Voltage Reference
      3. 6.3.3  Enable (ENA) and Internal Slow Start
      4. 6.3.4  Undervoltage Lockout (UVLO)
      5. 6.3.5  Boost Capacitor (BOOT)
      6. 6.3.6  Output Feedback (VSENSE) and Internal Compensation
      7. 6.3.7  Voltage Feed-Forward
      8. 6.3.8  Pulse-Width-Modulation (PWM) Control
      9. 6.3.9  Overcurrent Limiting
      10. 6.3.10 Overvoltage Protection
      11. 6.3.11 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operation near Minimum Input Voltage
      2. 6.4.2 Operation with ENA control
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 12-V Input to 5.0-V Output
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 7.2.1.2.2 Switching Frequency
          3. 7.2.1.2.3 Input Capacitors
          4. 7.2.1.2.4 Output Filter Components
            1. 7.2.1.2.4.1 Inductor Selection
            2. 7.2.1.2.4.2 Capacitor Selection
          5. 7.2.1.2.5 Output Voltage Set-Point
          6. 7.2.1.2.6 BOOT Capacitor
          7. 7.2.1.2.7 Catch Diode
          8. 7.2.1.2.8 Advanced Information
            1. 7.2.1.2.8.1 Output Voltage Limitations
            2. 7.2.1.2.8.2 Internal Compensation Network
            3. 7.2.1.2.8.3 Thermal Calculations
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Wide Input Voltage Ranges with TPS5430
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Wide Input Voltage Ranges with TPS5431
          1. 7.2.2.3.1 Design Requirements
          2. 7.2.2.3.2 Detailed Design Procedure
      3. 7.2.3 Circuit Using Ceramic Output Filter Capacitors
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
          1. 7.2.3.2.1 Output Filter Component Selection
          2. 7.2.3.2.2 External Compensation Network
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Development Support
        1. 8.1.2.1 Custom Design With WEBENCH® Tools
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information (DDA Package)

THERMAL METRIC(1) TPS543X  UNIT
DDA (HSOIC)
8 PINs
RθJA Junction-to-ambient thermal resistance (TPS5430EVM)(2)         45 °C/W
RθJA Junction-to-ambient thermal resistance (JESD 51-7)(3)      42.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance   46 °C/W
RθJB Junction-to-board thermal resistance 15 °C/W
ψJT Junction-to-top characterization parameter 5.2 °C/W
ψJB Junction-to-board characterization parameter 15.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance    6 °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.  
(2) Refer to the EVM User's Guide for board layout and additional information.  For thermal design information please see the Maximum Ambient Temperature section.  
(3) The value of RΘJA given in this table is only valid for comparison with other packages and cannot be used for design purposes.  These values were calculated in accordance with JESD 51-7, and simulated on a 4-layer JEDEC board.  They do not represent the performance obtained in an actual application.  For example, the EVM RΘJA = TBD ℃/W.  For design information please see the Maximum Ambient Temperature section.