SLVS412F December   2001  – April 2019 TPS54310

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Dissipation Ratings
    6. 7.6 Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Undervoltage Lockout (UVLO)
      2. 8.3.2  Slow Start and Enable (SS/ENA)
      3. 8.3.3  VBIAS Regulator (VBIAS)
      4. 8.3.4  Voltage Reference
      5. 8.3.5  Oscillator and PWM Ramp
      6. 8.3.6  Error Amplifier
      7. 8.3.7  PWM Control
      8. 8.3.8  Dead-Time Control and MOSFET Drivers
      9. 8.3.9  Overcurrent Protection
      10. 8.3.10 Thermal Shutdown
      11. 8.3.11 Powergood (PWRGD)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Conduction Mode
      2. 8.4.2 Switching Frequency Configuration
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Voltage
        2. 9.2.2.2 Feedback Circuit
        3. 9.2.2.3 Setting the Output Voltage
        4. 9.2.2.4 Operating Frequency
        5. 9.2.2.5 Output Filter
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related DC/DC Products
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Dissipation Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
PACKAGE TA = 25°C
POWER RATING		 TA = 70°C
POWER RATING		 TA = 85°C
POWER RATING
20-Pin PWP with solder 3.85 W(3) 2.12 W 1.54 W
20-Pin PWP without solder 1.73 W 0.96 W 0.69 W
(1) For more information on the PWP package, refer to TI technical brief, literature number SLMA002.
(2) Test board conditions:
  1. 3 inch × 3 inch, 2 layers, Thickness: 0.062 inch
  2. 1.5 oz copper traces located on the top of the PCB
  3. 1.5 oz copper ground plane on the bottom of the PCB
  4. Ten thermal vias (see recommended land pattern in application section of this data sheet)
(3) Maximum power dissipation may be limited by overcurrent protection.