SLUSEE1C may   2020  – april 2023 TPS543320

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VIN Pins and VIN UVLO
      2. 7.3.2  Enable and Adjustable UVLO
      3. 7.3.3  Adjusting the Output Voltage
      4. 7.3.4  Switching Frequency Selection
      5. 7.3.5  Switching Frequency Synchronization to an External Clock
        1. 7.3.5.1 Internal PWM Oscillator Frequency
        2. 7.3.5.2 Loss of Synchronization
        3. 7.3.5.3 Interfacing the SYNC/FSEL Pin
      6. 7.3.6  Ramp Amplitude Selection
      7. 7.3.7  Soft Start and Prebiased Output Start-Up
      8. 7.3.8  Mode Pin
      9. 7.3.9  Power Good (PGOOD)
      10. 7.3.10 Current Protection
        1. 7.3.10.1 Positive Inductor Current Protection
        2. 7.3.10.2 Negative Inductor Current Protection
      11. 7.3.11 Output Overvoltage and Undervoltage Protection
      12. 7.3.12 Overtemperature Protection
      13. 7.3.13 Output Voltage Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Forced Continuous-Conduction Mode
      2. 7.4.2 Discontinuous Conduction Mode During Soft Start
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 3.3-V Output, 1.0-MHz Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Switching Frequency
          2. 8.2.1.2.2  Output Inductor Selection
          3. 8.2.1.2.3  Output Capacitor
          4. 8.2.1.2.4  Input Capacitor
          5. 8.2.1.2.5  Adjustable Undervoltage Lockout
          6. 8.2.1.2.6  Output Voltage Resistors Selection
          7. 8.2.1.2.7  Bootstrap Capacitor Selection
          8. 8.2.1.2.8  BP5 Capacitor Selection
          9. 8.2.1.2.9  PGOOD Pullup Resistor
          10. 8.2.1.2.10 Current Limit Selection
          11. 8.2.1.2.11 Soft-Start Time Selection
          12. 8.2.1.2.12 Ramp Selection and Control Loop Stability
          13. 8.2.1.2.13 MODE Pin
        3. 8.2.1.3 Application Curves
      2. 8.2.2 1.8-V Output, 1.5-MHz Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS543320 UNIT
RPY (QFN, JEDEC) RPY (QFN, TI EVM)
14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 58.9 29.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 37.8 Not applicable (2) °C/W
RθJB Junction-to-board thermal resistance 7.3 Not applicable (2) °C/W
ψJT Junction-to-top characterization parameter 0.9 1.8 °C/W
ψJB Junction-to-board characterization parameter 7.2 13.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Not applicable to an EVM layout.