SLUSCK3 July   2016 TPS54335-2A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency PWM Control
      2. 7.3.2  Light-Load Operation
      3. 7.3.3  Voltage Reference
      4. 7.3.4  Adjusting the Output Voltage
      5. 7.3.5  Enabling and Adjusting Undervoltage Lockout
      6. 7.3.6  Error Amplifier
      7. 7.3.7  Slope Compensation and Output Current
      8. 7.3.8  Safe Startup into Pre-Biased Outputs
      9. 7.3.9  Bootstrap Voltage (BOOT)
      10. 7.3.10 Output Overvoltage Protection (OVP)
      11. 7.3.11 Overcurrent Protection
        1. 7.3.11.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.11.2 Low-Side MOSFET Overcurrent Protection
      12. 7.3.12 Thermal Shutdown
      13. 7.3.13 Small-Signal Model for Loop Response
      14. 7.3.14 Simple Small-Signal Model for Peak Current-Mode Control
      15. 7.3.15 Small-Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VI < 4.5 V (minimum VI)
      2. 7.4.2 Operation With EN Control
      3. 7.4.3 Operation With EN Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Supplementary Guidance
      2. 8.1.2 The DRC Package
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Switching Frequency
        2. 8.2.2.2 Output Voltage Set Point
        3. 8.2.2.3 Undervoltage Lockout Set Point
        4. 8.2.2.4 Input Capacitors
        5. 8.2.2.5 Output Filter Components
          1. 8.2.2.5.1 Inductor Selection
          2. 8.2.2.5.2 Capacitor Selection
        6. 8.2.2.6 Compensation Components
        7. 8.2.2.7 Bootstrap Capacitor
        8. 8.2.2.8 Power Dissipation Estimate
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resource
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

For the WEBENCH circuit design and selection simulation services, go to www.ti.com/WEBENCH.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

Designing Type III Compensation for Current Mode Step-Down Converters (SLVA352)

11.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

11.4 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.5 Community Resource

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.6 Trademarks

Eco-mode, E2E are trademarks of Texas Instruments.

WEBENCH is a registered trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.7 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.8 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.