SLUSCK3 July   2016 TPS54335-2A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency PWM Control
      2. 7.3.2  Light-Load Operation
      3. 7.3.3  Voltage Reference
      4. 7.3.4  Adjusting the Output Voltage
      5. 7.3.5  Enabling and Adjusting Undervoltage Lockout
      6. 7.3.6  Error Amplifier
      7. 7.3.7  Slope Compensation and Output Current
      8. 7.3.8  Safe Startup into Pre-Biased Outputs
      9. 7.3.9  Bootstrap Voltage (BOOT)
      10. 7.3.10 Output Overvoltage Protection (OVP)
      11. 7.3.11 Overcurrent Protection
        1. 7.3.11.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.11.2 Low-Side MOSFET Overcurrent Protection
      12. 7.3.12 Thermal Shutdown
      13. 7.3.13 Small-Signal Model for Loop Response
      14. 7.3.14 Simple Small-Signal Model for Peak Current-Mode Control
      15. 7.3.15 Small-Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VI < 4.5 V (minimum VI)
      2. 7.4.2 Operation With EN Control
      3. 7.4.3 Operation With EN Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Supplementary Guidance
      2. 8.1.2 The DRC Package
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Switching Frequency
        2. 8.2.2.2 Output Voltage Set Point
        3. 8.2.2.3 Undervoltage Lockout Set Point
        4. 8.2.2.4 Input Capacitors
        5. 8.2.2.5 Output Filter Components
          1. 8.2.2.5.1 Inductor Selection
          2. 8.2.2.5.2 Capacitor Selection
        6. 8.2.2.6 Compensation Components
        7. 8.2.2.7 Bootstrap Capacitor
        8. 8.2.2.8 Power Dissipation Estimate
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resource
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
Input voltage VIN –0.3 30 V
EN –0.3 6 V
BOOT –0.3 (VPH + 7.5) V
VSENSE –0.3 3 V
COMP –0.3 3 V
RT –0.3 3 V
Output voltage BOOT-PH 0 7.5 V
PH –1 30 V
PH, 10-ns transient –3.5 30 V
VDIFF (GND to exposed thermal pad) –0.2 0.2 V
Source current EN 100 100 µA
RT 100 100 µA
PH Current-limit A
Sink current PH Current-limit A
COMP 200 200 µA
Operating junction temperature –40 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under the absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under the recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS–001, all pins(1) 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VSS Supply input voltage 4.5 28 V
VOUT Output voltage 0.8 24 V
IOUT Output current 0 3 A
TJ Operating junction temperature(1) –40 150 °C
(1) The device must operate within 150°C to ensure continuous function and operation of the device.

6.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC TPS54335-2A UNIT
DRC (VSON)
10 PINS
RθJA Junction-to-ambient thermal resistance 43.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 55.4 °C/W
RθJB Junction-to-board thermal resistance 18.9 °C/W
ψJT Junction-to-top characterization parameter 0.7 °C/W
ψJB Junction-to-board characterization parameter 19.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.3 °C/W

6.5 Electrical Characteristics

The electrical ratings specified in this section apply to all specifications in this document unless otherwise noted. These specifications are interpreted as conditions that will not degrade the parametric or functional specifications of the device for the life of the product containing it. TJ = –40°C to 150°C, V = 4.5 to 28 V, (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY VOLTAGE AND UVLO (VIN PIN)
Operating input voltage 4.5 28 V
Input UVLO threshold Rising V 4 4.5 V
Input UVLO hysteresis 180 400 mV
VIN-shutdown supply current = 0 V 2 10 µA
VIN-operating non-switching supply current = 810 mV 310 800 µA
ENABLE (EN PIN)
Enable threshold Rising 1.21 1.28 V
Enable threshold Falling 1.1 1.17 V
Input current = 1.1 V 1.15 µA
Hysteresis current = 1.3 V 3.3 µA
VOLTAGE REFERENCE
Reference TJ =25°C 0.7936 0.8 0.8064 V
0.788 0.8 0.812
MOSFET
High-side switch resistance(1) = 3 V 160 280 mΩ
= 6 V 128 230 mΩ
Low-side switch resistance(1) V = 12 V 84 170 mΩ
ERROR AMPLIFIER
Error-amplifier transconductance (gm) –2 µA < ICOMP < 2 µA, VCOMP = 1 V 1300 µmhos
Error-amplifier source and sink VCOMP = 1 V, 100-mV overdrive 100 µA
Start switching peak current threshold(2) 0.5 A
COMP to ISWITCH gm 8 A/V
CURRENT-LIMIT
High-side switch current-limit threshold  4 4.9 6.5 A
Low-side switch sourcing current-limit 3.5 4.7 6.1 A
Low-side switch sinking current-limit 0 A
THERMAL SHUTDOWN
Thermal shutdown(2) 160 175 °C
Thermal shutdown hysteresis(2) 10 °C
BOOT PIN
BOOT-PH UVLO  2.1 3 V
(1) Measured at pins
(2) Not production tested.

6.6 Timing Requirements

MIN TYP MAX UNIT
CURRENT-LIMIT
Hiccup wait time 512 Cycles
Hiccup time before restart 16384 Cycles
THERMAL SHUTDOWN
Thermal shutdown hiccup time 32768 Cycles
SOFT START
Internal soft-start time, TPS54335-2A 2 ms

6.7 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PH PIN
Minimum on time Measured at 90% to 90% of VIN, IPH = 2 A 94 145  ns
Minimum off time ≥ 3 V 0%
SWITCHING FREQUENCY
Switching frequency range, TPS54335-2A 50 1500 kHz
R = 100 kΩ 384 480 576 kHz
R = 1000 kΩ, –40°C to 105°C 40 50 60 kHz
R = 30 kΩ 1200 1500 1800 kHz

6.8 Typical Characteristics

TPS54335-2A C001_SLVSC03.png
VIN = 12 V
Figure 1. High-Side MOSFET on Resistance vs Junction Temperature
TPS54335-2A C003_SLVSC03.png
Figure 3. Voltage Reference vs Junction Temperature
TPS54335-2A C005_SLVSC03.png
VIN = 12 V
Figure 5. UVLO Threshold vs Junction Temperature
TPS54335-2A C007_SLVSC03.png
VIN = 12 V
Figure 7. Pullup Current vs Junction Temperature
TPS54335-2A C009_SLVSC03.png
VEN = 0 V
Figure 9. Shutdown Quiescent Current vs Input Voltage
TPS54335-2A C011_SLVSC03.png
VIN = 12 V
Figure 11. Minimum Controllable On Time vs Junction Temperature
TPS54335-2A C013_SLVSC03.png
Figure 13. BOOT-PH UVLO Threshold vs Junction Temperature
TPS54335-2A C002_SLVSC03.png
VIN = 12 V
Figure 2. Low-Side MOSFET on Resistance vs Junction Temperature
TPS54335-2A C004_SLVSC03.png
Figure 4. Oscillator Frequency vs Junction Temperature
TPS54335-2A C006_SLVSC03.png
VIN = 12 V
Figure 6. Hysteresis Current vs Junction Temperature
TPS54335-2A C008_SLVSC03.png
Figure 8. Non-Switching Operating Quiescent Current vs Input Voltage
TPS54335-2A C010_SLVSC03.png
Figure 10. SS Charge Current vs Junction Temperature
TPS54335-2A C012_SLVSC03.png
VIN = 12 V
Figure 12. Minimum Controllable Duty Ratio vs Junction Temperature
TPS54335-2A C014_SLVSC03.gif
Figure 14. Current Limit Threshold vs Input Voltage