SLVSBZ2A September   2013  – November 2014 TPS54360-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Slope Compensation Output Current
      3. 7.3.3  Pulse Skip Eco-Mode™
      4. 7.3.4  Low Dropout Operation and Bootstrap Voltage (BOOT)
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Adjusting the Output Voltage
      7. 7.3.7  Enable and Adjusting Undervoltage Lockout
      8. 7.3.8  Internal Soft-Start
      9. 7.3.9  Constant Switching Frequency and Timing Resistor (RT/CLK) Pin)
      10. 7.3.10 Accurate Current Limit Operation and Maximum Switching Frequency
      11. 7.3.11 Synchronization to RT/CLK Pin
      12. 7.3.12 Overvoltage Protection
      13. 7.3.13 Thermal Shutdown
      14. 7.3.14 Small Signal Model for Loop Response
      15. 7.3.15 Simple Small Signal Model for Peak Current Mode Control
      16. 7.3.16 Small Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation near Minimum VIN (VVIN = < 4.5 V)
      2. 7.4.2 Operation with EN Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 5-V Output TPS54360-Q1 Design Example
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Selecting the Switching Frequency
          2. 8.2.1.2.2  Output Inductor Selection (LO)
          3. 8.2.1.2.3  Output Capacitor
          4. 8.2.1.2.4  Catch Diode
          5. 8.2.1.2.5  Input Capacitor
          6. 8.2.1.2.6  Bootstrap Capacitor Selection
          7. 8.2.1.2.7  Undervoltage Lockout Set Point
          8. 8.2.1.2.8  Output Voltage and Feedback Resistors Selection
          9. 8.2.1.2.9  Compensation
          10. 8.2.1.2.10 Discontinuous Conduction Mode and Eco-Mode™ Boundary
          11. 8.2.1.2.11 Power Dissipation Estimate
        3. 8.2.1.3 Application Curves
      2. 8.2.2 TPS54360-Q1 Inverting Power Supply
      3. 8.2.3 TPS54360-Q1 Split Rail Power Supply
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Estimated Circuit Area
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Input voltage VIN –0.3 65 V
EN –0.3 8.4
FB –0.3 3
COMP –0.3 3
RT/CLK –0.3 3.6
Output voltage BOOT-SW –0.3 8 V
SW –0.6 65
SW, 10-ns Transient –2 65
Operating junction temperature -40 150 °C
(1) Stresses beyond those listed under may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) –2000 2000 V
Charged device model (CDM), per AEC Q100-011 –500 500
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VI Input voltage range 4.5 60 V
TJ Operating junction temperature –40 150 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS54360-Q1 UNIT
DDA
8 PINS
θJA Junction-to-ambient thermal resistance (standard board) 42 °C/W
ψJT Junction-to-top characterization parameter 5.9
ψJB Junction-to-board characterization parameter 23.4
θθJC(top) Junction-to-case (top) thermal resistance 45.8
θθJC(bot) Junction-to-case (bottom) thermal resistance 3.6
θJB Junction-to-board thermal resistance 23.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

TJ = –40°C to 150°C, VIN = 4.5 to 60 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY VOLTAGE (VIN PIN)
Operating input voltage 4.5 60 V
Internal undervoltage lockout threshold Rising 4.1 4.3 4.48 V
Internal undervoltage lockout threshold hysteresis 325 mV
Shutdown supply current EN = 0 V, 25°C, 4.5 V ≤ VIN ≤ 60 V 2.25 4.5 μA
Operating: nonswitching supply current FB = 0.9 V, TA = 25°C 146 175
ENABLE AND UVLO (EN PIN)
Enable threshold voltage No voltage hysteresis, rising and falling 1.1 1.2 1.3 V
Input current Enable threshold +50 mV –4.6 μA
Enable threshold –50 mV –0.58 –1.2 –1.8
Hysteresis current –2.2 –3.4 -4.5 μA
Enable to COMP active VIN = 12 V, TA = 25°C 540 µs
INTERNAL SOFT-START TIME
Soft-Start Time fSW = 500 kHz, 10% to 90% 2.1 ms
Soft-Start Time fSW = 2.5 MHz, 10% to 90% 0.42 ms
VOLTAGE REFERENCE
Voltage reference 0.792 0.8 0.808 V
HIGH-SIDE MOSFET
On-resistance VIN = 12 V, BOOT-SW = 6 V 92 190 mΩ
ERROR AMPLIFIER
Input current 50 nA
Error amplifier transconductance (gM) –2 μA < ICOMP < 2 μA, VCOMP = 1 V 350 μS
Error amplifier transconductance (gM) during soft-start –2 μA < ICOMP < 2 μA, VCOMP = 1 V, VFB = 0.4 V 77 μS
Error amplifier DC gain VFB = 0.8 V 10,000 V/V
Min unity gain bandwidth 2500 kHz
Error amplifier source/sink V(COMP) = 1 V, 100 mV overdrive ±30 μA
COMP to SW current transconductance 12 A/V
CURRENT LIMIT
Current limit threshold All VIN and temperatures, Open-loop(1) 4.5 5.5 6.8 A
All temperatures, VIN = 12 V, Open-loop(1) 4.5 5.5 6.25
VIN = 12 V, TA = 25°C, Open-loop(1) 5.2 5.5 5.85
Current limit threshold delay 60 ns
THERMAL SHUTDOWN
Thermal shutdown 176 °C
Thermal shutdown hysteresis 12 °C
(1) Open-loop current limit measured directly at the SW pin and is independent of the inductor value and slope compensation.

6.6 Timing Requirements

TIMING RESISTOR AND EXTERNAL CLOCK (RT/CLK PIN) MIN TYP MAX UNIT
Switching frequency range using RT mode 100 2500 kHz
ƒSW Switching frequency RT = 200 kΩ 450 500 550 kHz
Switching frequency range using CLK mode 160 2300 kHz
Minimum CLK input pulse width 15 ns
RT/CLK high threshold 1.55 2 V
RT/CLK low threshold 0.5 1.2 V
RT/CLK falling edge to SW rising edge delay Measured at 500 kHz with RT resistor in series 55 ns
PLL lock in time Measured at 500 kHz 78 μs

6.7 Typical Characteristics

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Figure 1. On-Resistance vs Junction Temperature
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Figure 3. Switch Current Limit vs Junction Temperature
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Figure 5. Switching Frequency vs Junction Temperature
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Figure 7. Switching Frequency vs RT/CLK Resistance High Frequency Range
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Figure 9. EA Transconductance During Soft-Start vs Junction Temperature
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Figure 11. EN Pin Current vs Junction Temperature
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Figure 13. EN Pin Current Hysteresis vs Junction Temperature
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Figure 15. Shutdown Supply Current vs Junction Temperature
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Figure 17. VIN Supply Current vs Junction Temperature
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Figure 19. BOOT-SW UVLO vs Junction Temperature
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Figure 21. Soft-Start Time vs Switching Frequency
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Figure 2. Voltage Reference vs Junction Temperature
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Figure 4. Switch Current Limit vs Input Voltage
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Figure 6. Switching Frequency vs RT/CLK Resistance Low Frequency Range
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Figure 8. EA Transconductance vs Junction Temperature
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Figure 10. EN Pin Voltage vs Junction Temperature
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Figure 12. EN Pin Current vs Junction Temperature
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Figure 14. Switching Frequency vs FB
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Figure 16. Shutdown Supply Current vs Input Voltage (VIN)
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Figure 18. VIN Supply Current vs Input Voltage
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Figure 20. Input Voltage UVLO vs Junction Temperature