SLVSDQ8B October   2016  – June 2021 TPS54388C-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fixed-Frequency PWM Control
      2. 7.3.2 Slope Compensation and Output Current
      3. 7.3.3 Bootstrap Voltage (BOOT) and Low-Dropout Operation
      4. 7.3.4 Error Amplifier
      5. 7.3.5 Voltage Reference
    4. 7.4 Device Functional Modes
      1. 7.4.1  Adjusting the Output Voltage
      2. 7.4.2  Enable Functionality and Adjusting Undervoltage Lockout
      3. 7.4.3  Slow-Start or Tracking Pin
      4. 7.4.4  Sequencing
      5. 7.4.5  Constant Switching Frequency and Timing Resistor (RT/CLK Pin)
      6. 7.4.6  Overcurrent Protection
      7. 7.4.7  Frequency Shift
      8. 7.4.8  Reverse Overcurrent Protection
      9. 7.4.9  Synchronize Using the RT/CLK Pin
      10. 7.4.10 Power Good (PWRGD Pin)
      11. 7.4.11 Overvoltage Transient Protection
      12. 7.4.12 Thermal Shutdown
      13. 7.4.13 Small-Signal Model for Loop Response
      14. 7.4.14 Simple Small-Signal Model for Peak-Current-Mode Control
      15. 7.4.15 Small-Signal Model for Frequency Compensation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Selecting the Switching Frequency
        2. 8.2.2.2 Output Inductor Selection
        3. 8.2.2.3 Output Capacitor
        4. 8.2.2.4 Input Capacitor
        5. 8.2.2.5 Slow-Start Capacitor
        6. 8.2.2.6 Bootstrap Capacitor Selection
        7. 8.2.2.7 Output-Voltage and Feedback-Resistor Selection
        8. 8.2.2.8 Compensation
        9. 8.2.2.9 Power-Dissipation Estimate
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

Figure 5-1 RTE Package16-Pin WQFN With Exposed Thermal PadTop View
Table 5-1 Pin Functions
PIN I/O(1) DESCRIPTION
NAME NO.
AGND 5 Connect analog ground electrically to GND close to the device.
BOOT 13 O The device requires a bootstrap capacitor between BOOT and PH. A voltage on this capacitor that is below the minimum required by the BOOT UVLO forces the output to switch off until the capacitor recharges.
COMP 7 O Error amplifier output, and input to the output-switch current comparator. Connect frequency-compensation components to this pin.
EN 15 I Enable pin, internal pullup-current source. Pull below 1.2 V to disable. Float to enable. One can use this pin to set the on-off threshold (adjust UVLO) with two additional resistors.
GND 3 Power ground. Directly connect this pin electrically to the thermal pad under the device.
4
PH 10 O The source of the internal high-side power MOSFET, and drain of the internal low-side (synchronous) rectifier MOSFET
11
12
PWRGD 14 O An open-drain output; asserted low if output voltage is low due to thermal shutdown, overcurrent, over- or undervoltage, or EN shutdown.
RT/CLK 8 I Resistor-timing or external-clock input pin
SS/TR 9 I Slow start and tracking. An external capacitor connected to this pin sets the output-voltage rise time. Another use of this pin is for tracking.
VIN 1 I Input supply voltage, 2.95 V to 6 V
2
16
VSENSE 6 I Inverting node of the transconductance (gm) error amplifier
Thermal pad Connect the GND pin to the exposed thermal pad for proper operation. Connect this thermal pad to any internal PCB ground planes using multiple vias for good thermal performance.
I = input, O = output